LED Package Dummy Lead Frame for PCB Wiring Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing costs of backlight assemblies using top view type LEDs are increased due to the limited width of the printed circuit board (PCB) and the need for multiple layers and wirings to enhance luminance, which complicates the manufacturing process.
Innovation Solution
Incorporating a dummy lead frame in the LED package that is electrically isolated from the light-emitting chip and lead frames, allowing for reduced signal wiring on the PCB by connecting LED packages in driving blocks through dummy lead frames, thereby decreasing the number and length of signal wirings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If top view type LEDs are used to increase luminance, then luminance is improved, but PCB width is limited and manufacturing cost increases
Solution Approach 1:
The invention divides the LED package into functionally independent segments: a signal lead frame for electrical connection and a dummy lead frame for structural support and spacing. This segmentation allows the signal lead frame to be minimized for cost reduction while the dummy lead frame maintains the necessary package dimensions for high luminance output.
Solution Approach 2:
The invention extracts the structural support function from the signal lead frame by introducing a separate dummy lead frame. This extraction allows the signal lead frame to be reduced in size and complexity, directly addressing the PCB complexity issue while maintaining the package's luminance capability through the dummy lead frame's structural role.
2Illumination intensity
If the number of LEDs is increased to enhance luminance, then luminance is improved, but the number of wirings and layers of PCB are increased
Solution Approach 1:
The dummy lead frame serves multiple functions simultaneously: it provides structural support, maintains spacing between adjacent LED packages, enables thermal management, and facilitates electrical isolation. This multi-functionality reduces the need for additional components and complex PCB designs, thereby lowering manufacturing costs despite increased LED density.
Solution Approach 2:
The invention utilizes the vertical dimension by extending the dummy lead frame in the thickness direction of the package. This dimensional approach allows the dummy lead frame to perform spacing and support functions without increasing the planar footprint on the PCB, enabling higher LED density without proportionally increasing PCB complexity and manufacturing cost.
3Length of stationary object
If PCB width is reduced to decrease device thickness, then device thickness is reduced, but signal wiring becomes more complex
Solution Approach 1:
By segmenting the lead frame into signal and dummy components, the invention allows the signal lead frame to be optimized for minimal PCB wiring while the dummy lead frame handles structural requirements. This segmentation enables thin device design without compromising signal integrity or increasing wiring complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces manufacturing costs by minimizing the complexity and length of signal wirings on the PCB, enhancing the efficiency of the LED package and backlight assembly production.
Implementation Method 1
a light-emitting chip generating light
Data Source
AI summary
A light-emitting diode (“LED”) package includes a light-emitting chip, a case, first and second lead frames and a dummy lead frame. The light-emitting chip generates light. The case includes a bottom portion and a plurality of sidewalls, wherein the light-emitting chip is positioned in the case. The first and second lead frames are spaced apart from each other and are electrically connected to the light-emitting chip. The dummy lead frame is spaced apart from the light-emitting chip and the first and second lead frames, and is electrically isolated from the light-emitting chip and the first and second lead frames. The dummy lead frame is used as a wiring for connecting the LED package to another LED package, so that the number of signal wirings or a length of a signal wiring may be decreased, and a manufacturing cost of the LED package may be reduced.