LED Package Dummy Lead Frames Reduce PCB Wiring Complexity
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Solution Overview
Problem
The existing light emitting diode (LED) packages for backlight units in LCD devices require complex and costly multi-layered connection modes on printed circuit boards (PCBs), leading to increased fabrication costs and complexity due to the large number of connection wirings and power supply wirings needed.
Innovation Solution
The LED package design includes first and second lead frames electrically connected to the LED chip, with additional dummy lead frames that are electrically insulated and used as connective paths within the package, reducing the need for external wirings and allowing serial connection between LED packages without multi-layered wiring on the PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a multi-layered connection mode is used on the PCB to reduce wiring complexity, then the fabrication cost increases and the fabrication procedure becomes complicated
Solution Approach 1:
The patent transitions the connection structure from a two-dimensional PCB surface layout to a three-dimensional internal package structure. The dummy lead frames are positioned within the package body (in the Z-dimension) rather than on the PCB surface, allowing serial connections to be made internally within each LED package. This dimensional shift eliminates the need for multi-layered PCB connections while maintaining simple PCB fabrication.
2Area of stationary object
If the number of connection wirings and power supply wirings on the PCB is reduced, then the PCB width can be decreased, but the connection complexity must be managed
Solution Approach 1:
The patent combines multiple functions into the dummy lead frames, which serve both as structural support elements and as electrical connection paths. The dummy lead frames are electrically connected to the light emitting chip and to adjacent LED packages, merging the functions of mechanical support and electrical interconnection into a single component. This reduces the number of separate wiring elements needed on the PCB.
Solution Approach 2:
The dummy lead frames act as intermediary elements that facilitate serial connections between adjacent LED packages. Instead of requiring direct PCB-level wiring between packages, the dummy lead frames provide intermediate connection points within each package, mediating the electrical connection and simplifying the overall wiring architecture.
Data Source
AI summary
Disclosed is a light emitting diode (LED) package, which can be used for, for example, a light source module, a backlight unit and a display device, that may, for example, include an LED chip in a body portion of the LED package; first and second lead frames separated from each other in the body portion, each of the first and second lead frames including first and second leads that are electrically connected to the LED chip and are used as one of anode and cathode leads; and first and second dummy lead frames separated from each other in the body portion and electrically insulated from the first and second lead frames.