LED Eave Lamp PCB Layout for Waterproof Soldering and Heat Dissipation
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Solution Overview
Problem
Conventional eave lamps face challenges with waterproofing, heat dissipation, and short circuits due to limited installation space, which complicates manufacturing and increases costs.
Innovation Solution
An LED eave lamp design with insulated power supply lines, a printed circuit board (PCB) without circuit components on one side, and a manufacturing method that involves peeling insulating layers to expose soldering positions, facilitating soldering and reducing the risk of short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional waterproofing treatment with large amount of adhesives is used, then waterproofing performance is improved, but material cost and complexity increase
Solution Approach 1:
The patent extracts the circuit components from one side of the PCB, creating a component-free side that can be directly contacted with conductors. This eliminates the need for complex waterproofing treatments on the circuit side, as the conductors can be directly soldered to the PCB without adhesives or sealing layers, thereby reducing material cost and treatment complexity while maintaining waterproofing performance
Solution Approach 2:
The patent segments the PCB into two functional sides: one side with circuit components for electrical functions, and another side without components for direct conductor connection and heat dissipation. This segmentation allows the conductor to be directly mounted on the component-free side, eliminating the need for thick adhesives or complex waterproofing structures, thus resolving the contradiction between waterproofing reliability and device complexity
2Volume of moving object
If installation space at eave is limited, then compact design is required, but heat dissipation becomes difficult
Solution Approach 1:
The patent utilizes the z-dimension (thickness direction) of the PCB by creating a component-free side that can directly contact the conductor. This allows heat dissipation to occur through the thickness direction via thermal conduction from the LED to the conductor, rather than only through the planar area, enabling effective heat dissipation in limited installation space
Solution Approach 2:
The conductor serves as a thermal intermediary, directly contacting the PCB's component-free side to conduct heat away from the LED. This intermediary structure enables efficient heat transfer from the light source through the conductor without requiring large installation space, resolving the contradiction between compact design and heat dissipation
3Volume of moving object
If soldering is performed in limited operating space, then assembly is compact, but short circuit risk increases
Solution Approach 1:
The patent extracts all circuit components from one side of the PCB, creating a clean, component-free area where conductors can be soldered without risk of short circuits. This extraction eliminates the proximity of other circuit elements during the soldering process, allowing reliable welding in limited operating space while preventing short circuit occurrences
Solution Approach 2:
The patent performs preliminary preparation by ensuring one side of the PCB is completely free of circuit components before the soldering process. This preliminary action creates an ideal soldering environment where conductors can be reliably connected without the risk of short circuits, even in limited operating space, thereby improving assembly reliability
Data Source
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AI summary
Provided are an LED eave lamp and a method thereof. The method includes the steps of: for a long conductor having at least two power supply wires insulated from each other, taking the long conductor as a lamp strip, and peeling off an insulating layer of the conductor in advance to expose the power supply wires therein to form a soldering position; and soldering one side, free of any circuit components, of a printed circuit board (PCB) in a lamp body of the LED eave lamp at the soldering position. A back surface of the LED eave lamp is not provided with any circuit components, all necessary circuit components are encapsulated inside LED lamp bead, space utilization is better, and failure such as a short circuit at the soldering position is not easily caused, and mounting of the PCB and a bottom plate and heat dissipation are facilitated, and a better structural design of the LED eave lamp is achieved.