LED Edge Heating for Carbon Removal on Substrate Peripheries

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Solution Overview

Problem

Existing substrate processing techniques face challenges in efficiently removing carbon-containing substances from the peripheral edges of substrates without causing damage, particularly due to the limitations of laser and plasma-based methods in terms of controllability and uniformity.

Innovation Solution

A substrate processing apparatus utilizing an LED heating unit to irradiate the peripheral edges with LED light, combined with an oxygen-containing gas supply, effectively heats and removes carbon-containing substances while preventing damage to the substrate through precise temperature control and zone-specific heating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If laser light is focused on carbon-containing substances to heat and remove them, then removal efficiency is improved, but substrate damage risk increases and controllability deteriorates

Engineering Contradiction:
Improveremoval efficiencyVSAvoidcontrollability
Core Design Contradiction:
ProductivityVSEase of operation

Solution Approach 1:

The patent divides the heating function into multiple independent LED elements arranged in a matrix pattern, allowing individual or selective activation of specific LED elements corresponding to different regions of the substrate peripheral edge. This segmentation enables precise spatial control of heating zones, improving controllability while maintaining removal efficiency through coordinated operation of multiple elements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements zone-specific heating by controlling individual LED elements or groups of LEDs to heat only specific peripheral edge regions where carbon-containing substances are present. This local quality approach allows differential heating strategies for different substrate regions, improving controllability and preventing damage to areas that do not require heating.

Inventive Principle:
Principle #3Local quality

2Productivity

If high energy is used to remove carbon-containing substances efficiently, then removal efficiency is improved, but substrate damage increases

Engineering Contradiction:
Improveremoval efficiencyVSAvoidsubstrate damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the energy delivery parameters by using LED light sources with specific wavelengths that are selectively absorbed by carbon-containing substances. This parameter change allows efficient heating and removal of carbon deposits while using lower overall energy levels compared to laser methods, reducing the risk of substrate damage through controlled thermal exposure.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces an oxygen-containing gas environment during LED heating to accelerate the oxidation and removal of carbon-containing substances. This chemical enhancement allows efficient removal at lower temperatures and shorter exposure times, improving removal efficiency while minimizing thermal damage to the substrate through reduced heating duration and temperature requirements.

Inventive Principle:
Principle #38Strong oxidants (Accelerated oxidation)

3Manufacturing precision

If uniform heating is applied across the substrate, then processing uniformity is improved, but localized removal precision deteriorates

Engineering Contradiction:
Improveprocessing uniformityVSAvoidlocalized removal precision
Core Design Contradiction:
Manufacturing precisionVSMeasurement precision

Solution Approach 1:

The patent implements dynamic control of LED element activation, allowing the system to adaptively adjust which LED elements are active based on the specific locations and amounts of carbon-containing substances detected on the substrate peripheral edge. This dynamic operation enables the system to maintain uniform processing quality across different substrates and regions while achieving precise localized removal where needed, resolving the contradiction between uniformity and precision.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient and controlled removal of carbon-containing substances from the substrate edges with reduced risk of substrate damage, offering improved controllability and processing uniformity compared to traditional methods.

Implementation Method 1

an LED heating unit that has a plurality of LED elements and irradiates the peripheral edge of the substrate with LED light from the plurality of LED elements, thereby heating the carbon-containing substances present at the peripheral edge

Methodology Applied
Scientific EffectLight absorption and heating: Absorption (EM radiation)

Implementation Method 2

a gas supply unit that supplies an oxygen-containing gas to the peripheral edge of the substrate

Methodology Applied
Scientific EffectOxidation reaction: Oxidation

Data Source

PatentUS20240145267A1Substrate processing apparatus and substrate processing method
Publication Date: 2024.05.02 TOKYO ELECTRON LTD
  • US20240145267A1 patent drawing
  • US20240145267A1 patent drawing
  • US20240145267A1 patent drawing

AI summary

A substrate processing apparatus removes carbon-containing substances present at a peripheral edge of a substrate, which includes: a processing container; a substrate stage that places the substrate thereon within the processing container and supports at least a portion of the substrate excluding the peripheral edge; an LED heating unit that has a plurality of LED elements and irradiates the peripheral edge of the substrate with LED light from the plurality of LED elements, thereby heating the carbon-containing substances present at the peripheral edge; and a gas supply unit that supplies an oxygen-containing gas to the peripheral edge of the substrate.