Individually Addressable LED Modules with Edge Wiring
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Solution Overview
Problem
Existing LED lighting units face challenges in achieving individual addressability while minimizing the need for wiring tracks that consume valuable space and impede heat dissipation, particularly in closely packed arrays where heat must be dissipated vertically.
Innovation Solution
The solution involves a string of LED modules with terminal modules at both ends and an intermediate module connected in series, allowing for individual addressability without direct external connections to intermediate modules, thereby eliminating the need for wiring tracks between modules and optimizing heat dissipation by using a single planar wiring layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If wiring tracks run along intermediary spaces between LED module rows and columns to enable individual addressability, then individual LED addressability is achieved, but the spacing between modules increases, reducing array density and light intensity
Solution Approach 1:
The patent transitions from two-dimensional wiring tracks running between modules to one-dimensional wiring edges that run along the periphery of the substrate. This dimensional change allows wiring to be positioned at the boundaries rather than consuming space within the module array, thereby maintaining minimal spacing between LED modules while still enabling individual addressability through the edge-positioned wiring structure.
2Area of stationary object
If multi-layer wiring solutions are used to route tracks below LED modules, then individual addressability is achieved without consuming lateral space, but heat dissipation capacity is substantially limited
Solution Approach 1:
The patent segments the wiring structure into two distinct functional parts: wiring edges positioned at the periphery for electrical connections, and a separate heat sink structure positioned below the substrate for thermal management. This segmentation allows the wiring to be located at edges without interfering with the thermal path from LED modules to the heat sink, thereby maintaining both individual addressability and effective heat dissipation.
3Quantity of substance
If wiring tracks are positioned to minimize spacing between LED modules, then array density and light intensity are maximized, but heat dissipation path is impeded
Solution Approach 1:
The patent introduces an intermediary positioning of wiring edges at the periphery of the substrate, which acts as a mediator between the LED module array and the heat dissipation system. This edge-positioned wiring structure enables individual module addressability without interfering with the thermal path from the LED modules through the substrate to the heat sink, thereby maintaining both high array density and effective thermal conductivity.
Data Source
AI summary
The invention provides an interconnected string of three LED modules, having internal and external connections such that each LED in the string is fully individually addressable. LED biases and interconnects are oriented and configured such that individual addressability is achieved without the need for direct external signal connections to each LED in the string. Consequently embodiments are provided comprising pluralities of strings, arranged so as to form an array of LED modules, wherein wiring tracks running beneath, or along the intermediary spaces between, rows of LEDs are not required. Hence are provided LED devices comprising an array of individually addressable LED modules, having reduced spacing between rows and columns, and having optimal thermal path perpendicularly across the substrate layer. Provided devices have improved heat dissipation and greater achievable LED array density. Also provided are embodiments comprising one or more lens arrangements, suitable, for example, for adaptive beam-shaping applications.