LED Die Electrode Formation via Groove Etching and Layer Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current LED die manufacturing methods face challenges in achieving efficient electrical connection and protection of the light emitting structure, particularly in forming electrodes and transparent layers that ensure reliable performance and durability.
Innovation Solution
The method involves forming a light emitting structure on a substrate with specific semiconductor layers, etching grooves and connecting areas to expose the semiconductor layer, and then depositing electrodes and transparent protecting layers, followed by a reflection layer and additional protective layers, using materials like gold, silicon dioxide, and aluminum to enhance electrical connectivity and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes and transparent layers are formed to ensure reliable electrical connection and protection, then the reliability and durability of LED die are improved, but the manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent applies preliminary action by forming grooves and connecting areas on the light emitting structure before depositing the electrode patterns. This pre-preparation of the substrate surface ensures proper electrode positioning and electrical connection reliability, while streamlining the subsequent manufacturing steps.
Solution Approach 2:
The patent segments the electrode structure into multiple components including electrode patterns, connecting areas, and grooves. This segmentation allows each component to be optimized independently for its specific function (electrical connection, light transmission, or structural support), thereby improving overall reliability without requiring a monolithic complex design.
2Reliability
If grooves and connecting areas are etched to expose semiconductor layers for electrode formation, then electrical connectivity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The grooves and connecting areas are etched into the light emitting structure before electrode deposition. This preliminary etching action creates predefined pathways and exposure areas that guide subsequent electrode formation, ensuring accurate electrical connectivity while allowing standard etching tolerances.
Solution Approach 2:
The patent applies local quality by creating different surface features (grooves, connecting areas, flat regions) at specific locations on the light emitting structure. Each region is tailored with appropriate depth and geometry to fulfill its specific function, whether for electrode adhesion, light transmission, or electrical connection, thereby achieving high connectivity without requiring uniform high precision across the entire structure.
3Duration of action of stationary object
If multiple protective layers and reflection layers are deposited, then the durability and performance of LED die are improved, but the manufacturing time and process steps increase
Solution Approach 1:
The patent combines multiple protective functions into an integrated multi-layer structure where the transparent protecting layer, reflection layer, and additional protective layers work together as a unified protection system. This merging of functions into a coordinated layer stack achieves enhanced durability while allowing parallel processing of adjacent layers, reducing total manufacturing time compared to sequential single-layer processing.
Solution Approach 2:
The patent uses composite material structures with different layer compositions (transparent dielectric materials, reflective materials, protective coatings) to achieve multiple functions simultaneously. Each material is selected for its specific properties (transparency, reflectivity, protection), and their composite arrangement provides durable protection without requiring each individual layer to be excessively thick or complex, thereby optimizing the time-durability trade-off.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables robust electrical connections and protection of the LED die, improving its performance and longevity by ensuring effective exposure of semiconductor layers and robust electrode formation.
Implementation Method 1
a first transparent protecting layer is formed on the light emitting structure, the first electrode, and the second electrode
Implementation Method 2
a reflection layer is formed on the first transparent protecting layer
Data Source
AI summary
An LED die includes a substrate, a light emitting structure, electrodes, a first transparent protecting layer, a reflection layer, and a second transparent protecting layer. The light emitting structure includes a first semiconductor layer, an active layer, a second semiconductor layer successively formed on the substrate. A part of first semiconductor layer being exposed. A first electrode is formed the first semiconductor layer. A second electrode is formed on the second semiconductor layer. The first transparent protecting layer, the reflection layer, and the second transparent protecting layer successively formed on the first electrode. The present disclosure also provides a method of manufacturing the LED die.