LED Mounting on Electrode Outer Portions for Heat Dissipation
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Solution Overview
Problem
Conventional light-emitting devices with multiple LED elements mounted on a substrate suffer from ineffective heat dissipation, leading to reduced service life and compromised light emission characteristics due to heat concentration and light interference.
Innovation Solution
A light-emitting device design featuring a substrate with a gap between two electrodes, where LED elements are mounted on each electrode, allowing for parallel or series electrical connections, and heat dissipation through the electrodes, thereby reducing heat concentration and light interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple LED elements are mounted on a single portion of the substrate, then the light emission intensity is improved, but heat dissipation efficiency deteriorates and service life is reduced
Solution Approach 1:
The substrate is divided into multiple mounting portions, and LED elements are distributed across these separate portions rather than concentrating them in one area. This segmentation allows heat to be dispersed across multiple locations, improving heat dissipation efficiency while maintaining high light emission intensity through the combined output of distributed LED elements.
2Illumination intensity
If more LED elements are mounted on the substrate, then the light emission intensity is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The substrate is divided into multiple mounting portions with LED elements distributed across them. This segmentation prevents heat accumulation in any single location, thereby maintaining reliable operating temperatures even when numerous LED elements are installed, thus preserving service life while achieving high light emission intensity.
Solution Approach 2:
Different portions of the substrate are designed with specific characteristics optimized for their function - some portions are designed for LED mounting while others are designed for heat dissipation. This local quality differentiation allows the system to accommodate more LED elements without compromising reliability, as heat-generating and heat-dissipating areas are spatially separated.
3Device complexity
If LED elements are mounted close together, then the device complexity is reduced, but light emission characteristics are adversely affected due to light interference
Solution Approach 1:
The substrate is segmented into multiple mounting portions that are spatially separated. LED elements are mounted on these separated portions, which prevents light interference between adjacent elements while maintaining structural simplicity. The segmentation naturally provides adequate spacing without requiring complex positioning mechanisms.
Solution Approach 2:
Instead of arranging LED elements in a single-plane grid that requires precise spacing control, the invention uses multiple mounting portions that can be arranged in different spatial dimensions or layers. This dimensional approach allows LED elements to be positioned at optimal distances to avoid light interference while keeping the overall structure simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency and prevents substrate deterioration from light exposure, improving the service life and light emission characteristics of the device.
Implementation Method 1
a plurality of light-emitting diode elements are used as light sources
Implementation Method 2
heat generated due to the light emission of the LED elements concentrates at the second portion 3, leading to the fear that the heat will not be dissipated from the substrate 1 effectively
Data Source
AI summary
In an aspect of the present invention, a light-emitting device includes a substrate; a first electrode and a second electrode arranged on an upper surface of the substrate with a gap between the first electrode and the second electrode, the gap being positioned at a central portion of the upper surface of the substrate; a first light-emitting diode element electrically mounted on the first electrode; and a second light-emitting diode element electrically mounted on the second electrode, wherein the first electrode includes a first inner portion and a first outer portion that are two equal area portions divided at a center line of the first electrode, and the first light-emitting diode element is mounted on the first outer portion of the first electrode, and wherein the second electrode includes a second inner portion and a second outer portion that are two equal area portions divided at a center line of the second electrode, and the second light-emitting diode element is mounted on the second outer portion of the second electrode.