Packaged LED Electrode Isolation for Thermal Management
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Solution Overview
Problem
Conventional packaged light emitting devices face challenges in heat dissipation as the number of light emitting devices on a circuit board increases, necessitating effective heat management solutions.
Innovation Solution
The implementation of a packaged light emitting device with a mounting substrate featuring separated electrode portions and insulation support members, which include grooves and recesses to facilitate electrical insulation and heat dissipation, along with a sealing member to cover the light emitting device, enhances thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If light emitting devices are mounted densely on a circuit board to increase productivity, then the quantity of light emitting devices per unit area increases, but heat dissipation becomes insufficient due to reduced spacing between devices
Solution Approach 1:
The electrode structure is segmented into multiple isolated portions through grooves and recesses. The mounting substrate includes first and second electrode portions separated by grooves, with insulation support members filling these grooves to create electrically isolated segments. This segmentation allows independent thermal management for each electrode region, enabling better heat dissipation even when devices are densely mounted.
Solution Approach 2:
The patent introduces vertical dimensionality through recesses and protrusions in the electrode structure. The first electrode portion has a recess and the second electrode portion has a protrusion that fits into it, creating a three-dimensional isolated structure. This vertical separation enhances heat dissipation by creating additional thermal pathways and increasing surface area for heat transfer, while maintaining compact horizontal spacing for high device density.
2Reliability
If electrode portions are isolated using conventional insulation methods, then electrical insulation is achieved, but heat dissipation pathways are blocked and thermal management deteriorates
Solution Approach 1:
The insulation support member is selectively placed only in the groove regions between electrode portions, rather than covering the entire substrate. This localized insulation approach ensures electrical isolation where needed (between adjacent electrode portions) while leaving other areas open for heat dissipation. The insulation is concentrated in specific locations rather than uniformly distributed, allowing thermal pathways to remain open in critical heat generation zones.
Solution Approach 2:
The insulation support member is nested within the groove structure, and the protrusion of the second electrode portion is nested within the recess of the first electrode portion. This nested configuration allows the insulation to be embedded within the three-dimensional electrode structure rather than sitting on top, creating a compact design that provides both electrical isolation and thermal management. The nested structure maximizes space utilization while maintaining both insulation and heat dissipation functions.
Data Source
AI summary
A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.