LED Lead Electrode Nesting Structure for Solder Alignment Stability
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Solution Overview
Problem
In semiconductor light-emitting devices, misalignment of lead electrodes during solder mounting can lead to wire disconnection due to uneven shapes, causing detachment issues.
Innovation Solution
The use of plate-shaped lead electrodes with a nested structure, where one electrode has a protruding portion that fits into a recessed portion of the other, and both sides have hollowed regions filled with resin, creating a secure and aligned configuration to prevent misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If lead electrodes are made with uneven shapes to increase contact area with resin, then detachment resistance is improved, but misalignment during solder mounting occurs causing wire disconnection
Solution Approach 1:
The patent applies the nesting principle by creating a nested structure between adjacent lead electrodes, where one electrode has a protruding portion that fits into a recessed portion of the other electrode. This nested configuration allows the lead electrodes to interlock mechanically, providing both detachment resistance and alignment precision during solder mounting, thereby resolving the technical contradiction between these two requirements.
2Strength
If lead electrodes are made with uneven shapes to prevent detachment, then contact area with resin is increased, but misalignment in separation direction causes wire disconnection
Solution Approach 1:
The nested structure of protruding and recessed portions between adjacent lead electrodes provides mechanical interlocking that ensures reliable wire connections while maintaining adequate contact area with the resin. This eliminates the need for uneven shapes that would compromise wire connection reliability, thus resolving the contradiction between contact area and wire connection reliability.
3Ease of manufacture
If simple plate-shaped lead electrodes are used, then manufacturing is easier, but misalignment during solder mounting cannot be prevented
Solution Approach 1:
The nested structure can be integrated into the standard plate-shaped lead electrode manufacturing process through additive or subtractive methods, maintaining ease of manufacture while significantly improving alignment precision during solder mounting. The protruding and recessed portions are designed to be compatible with conventional fabrication techniques, thus resolving the contradiction between ease of manufacture and alignment precision.
Data Source
AI summary
A light-emitting device includes a first lead electrode and a second lead electrode, and a resin frame that covers an outer portion and a separation portion of the lead electrodes and has an opening portion that exposes the lead electrodes, and an LED. A protrusion provided in the first lead electrode is fitted into an enclosing portion provided in the second lead electrode to form a nested structure. Hollowed portions are provided in facing adjacent sides of the protrusion and the enclosing portion, and a region surrounded by the hollowed portion and the hollowed portion is filled with a part of a resin, thereby forming an anchor column.


