LED Electrode Recess Layout for Light Extraction and Bonding
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Solution Overview
Problem
Current semiconductor device packages face challenges in improving light extraction efficiency, electrical characteristics, bonding strength, and preventing current concentration and re-melting phenomena, while also requiring cost-effective manufacturing processes.
Innovation Solution
A semiconductor device package design featuring a light emitting structure with specific electrode and bonding pad configurations, including alternately disposed branch electrodes and offset electrodes, along with a package body structure that includes conductive frames and an adhesive layer for enhanced bonding and light diffusion, allowing for stable bonding at low temperatures and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional electrode configurations are used in semiconductor device packages, then manufacturing processes are simpler, but light extraction efficiency and electrical characteristics deteriorate
Solution Approach 1:
The electrode structure is segmented into multiple components including a lower electrode, an upper electrode, and multiple branch electrodes extending from the upper electrode. This segmentation allows each component to perform specific functions: the lower electrode provides base electrical connection, the upper electrode enhances light extraction, and the branch electrodes distribute electrical current, thereby improving overall device performance without excessive manufacturing complexity
Solution Approach 2:
The electrode structure transitions from a conventional planar two-dimensional configuration to a three-dimensional structure with vertical stacking (lower and upper electrodes) and lateral extensions (branch electrodes). This dimensional change increases the effective surface area for light extraction and electrical contact, improving both light extraction efficiency and electrical characteristics while maintaining manufacturing feasibility
2Device complexity
If conventional bonding pad configurations are used, then device structure is simpler, but bonding strength and reliability deteriorate
Solution Approach 1:
The bonding pad structure incorporates curved or rounded features rather than sharp corners, which distributes mechanical stress more evenly during bonding processes. This curvature design enhances bonding strength by preventing stress concentration at sharp edges, thereby improving reliability without significantly increasing device complexity
Solution Approach 2:
The bonding pad structure utilizes composite material layers including copper, tungsten, and dielectric materials with different mechanical and electrical properties. This composite construction provides both the electrical connectivity required for device function and the mechanical strength needed for reliable bonding, achieving enhanced bonding strength without excessive structural complexity
3Ease of manufacture
If standard package designs are used, then manufacturing costs are lower, but current concentration and re-melting phenomena occur
Solution Approach 1:
The electrode structure implements local quality variations through different electrode materials, thicknesses, and geometries in different regions. The lower electrode, upper electrode, and branch electrodes have optimized local properties that distribute current density evenly, preventing current concentration and re-melting phenomena while maintaining cost-effective manufacturing processes
4Ease of manufacture
If conventional electrode configurations are used, then manufacturing is easier, but electrical characteristics and light extraction efficiency deteriorate
Solution Approach 1:
The electrode system is divided into functionally distinct segments (lower electrode, upper electrode, branch electrodes) that can be manufactured using standard processes. Each segment is optimized for specific electrical characteristics, allowing precise control of current distribution and electrical performance while maintaining ease of manufacture through modular construction
Data Source
AI summary
A semiconductor device according to an embodiment may include: a light emitting structure; a light transmitting electrode layer disposed on the light emitting structure; and a reflective layer disposed on the light transmitting electrode layer and including a plurality of first openings and a plurality of second openings. The semiconductor device according to the embodiment may include: a first electrode in contact with a first conductivity type semiconductor layer of the light emitting structure; and a second electrode in contact with the light transmitting electrode layer through the plurality of first openings. The first electrode may include a first sub-electrode and a plurality of first branch electrodes, wherein the plurality of first branch electrodes are arranged extending toward the second electrode from the first sub-electrode; the second electrode may include a second sub-electrode and a plurality of second branch electrodes, wherein the plurality of second branch electrodes are arranged extending toward the first electrode from the second sub-electrode; and the plurality of first branch electrodes and the plurality of second branch electrodes may be alternately disposed on an upper surface of the reflective layer.