LED Display Electrode Layout With Soldered Anti-Disconnection Contact

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Solution Overview

Problem

Display devices using light-emitting diodes (LEDs) face issues with the disconnection of the second electrode for driving the light-emitting element, which can lead to operational failures.

Innovation Solution

The display device incorporates a substrate with an insulating layer, a bank, a contact electrode, a first electrode, a first solder pattern, a light-emitting element, and a second electrode design that includes a second solder pattern between the contact electrode and a contact hole, ensuring stable electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional electrode structure is used, then the device structure is simple, but the second electrode may become disconnected leading to operational failures

Engineering Contradiction:
Improveelectrode connection stabilityVSAvoidelectrode structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The electrode structure is segmented into multiple functional layers: contact electrode, first electrode, second electrode, and auxiliary electrode. Each layer serves a specific function in the electrical connection path, distributing the connection responsibilities across multiple segments to prevent single-point failure and improve overall reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The auxiliary electrode is positioned in advance to overlap with the contact electrode through the bank structure, creating a pre-established electrical connection path. This preliminary arrangement ensures that even if the main electrode path fails, the auxiliary path is already in place to maintain connectivity.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If the second electrode is extended to contact the contact electrode directly, then the connection path is short, but disconnection may occur due to stress or manufacturing variations

Engineering Contradiction:
Improveelectrode connection stabilityVSAvoidmanufacturing alignment ease
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The first electrode and first solder pattern serve as intermediary elements between the second electrode and the contact electrode. These intermediaries absorb manufacturing alignment variations and reduce stress concentration, making the overall connection more tolerant to dimensional variations while maintaining electrical continuity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The electrode connections are arranged in multiple dimensions and layers rather than a single linear path. The auxiliary electrode overlaps with the contact electrode in the vertical dimension through the bank structure, creating a three-dimensional connection architecture that provides redundancy and reduces dependency on precise two-dimensional alignment.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20260033108A1Display device
Publication Date: 2026.01.29 LG DISPLAY CO LTD
  • US20260033108A1 patent drawing
  • US20260033108A1 patent drawing
  • US20260033108A1 patent drawing

AI summary

A display device includes a substrate, an insulating layer disposed on the substrate, a bank disposed on the insulating layer, a contact electrode disposed to be spaced apart from the bank on the insulating layer, a first electrode disposed on the bank, a first solder pattern disposed on the first electrode, a light-emitting element disposed on the first solder pattern, a first optical layer disposed around the bank and the light-emitting element, a second optical layer disposed around the first optical layer and having a contact hole overlapping at least a part of the contact electrode, a second electrode disposed on the light-emitting element, the first optical layer, and the second optical layer and extending to an inside of the contact hole, and a second solder pattern disposed between the second electrode and the contact electrode under the contact hole of the second optical layer.