LED Device with Embedded Polymer Carrier for Thermal Management
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Solution Overview
Problem
Light-emitting diode (LED) devices face challenges in luminous efficacy, service life, thermal management, and protection against excessive temperatures and electrostatic discharges, particularly in compact mobile applications like smartphone camera flashes, where space is limited and shading by protective components must be minimized.
Innovation Solution
A light-emitting diode device with a carrier having multiple polymer layers, where an electrical component such as an ESD protection element or thermal sensor is embedded in inner layers, allowing for reduced thermal stresses and improved thermal management, and is connected via vias for efficient electrical contact, enabling a space-saving and reliable arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protective components are added to protect LEDs from ESD and thermal stresses, then reliability is improved, but device height and space occupation increase
Solution Approach 1:
The patent embeds protective components (ESD protection elements, thermal sensors) directly within the carrier structure itself, nesting them inside the polymer layers. This eliminates the need for separate protective components mounted on top of the LED assembly, thereby maintaining reliability while minimizing device height and space occupation.
Solution Approach 2:
The patent combines the protective functions (ESD protection, thermal management) with the carrier structure by integrating these components into the polymer layers. The carrier serves both as mechanical support and as housing for protective components, merging multiple functions into a single integrated structure that reduces overall device complexity and height.
2Duration of action of stationary object
If multiple polymer layers are used to embed electrical components, then thermal stresses are reduced and service life is improved, but device complexity increases
Solution Approach 1:
The patent divides the carrier into multiple polymer layers with different material properties, allowing electrical components to be embedded at specific depths. This segmentation enables optimized thermal management and stress distribution, as each layer can be tailored for specific mechanical or thermal characteristics, thereby extending service life through reduced thermal stresses.
Solution Approach 2:
Different polymer layers are assigned different material properties (mechanical strength, thermal conductivity) based on their specific functions. The layer containing the electrical component has optimized properties for thermal management, while other layers provide mechanical support or electrical isolation. This local optimization reduces thermal stresses on sensitive components without requiring uniform complexity throughout the entire structure.
3Object-affected harmful factors
If electrical components are embedded in inner polymer layers, then thermal stresses on components are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates electrical components during the carrier manufacturing process itself, before final assembly. The components are embedded into recesses or cavities formed in the polymer layers during molding or lamination. This preliminary integration ensures precise positioning and reduces thermal stresses, while the manufacturing process is designed to accommodate this embedding without requiring excessive post-processing precision.
Data Source
Figure 1~3
Figure 4~5
AI summary
The invention relates to a light-emitting diode device (1) comprising at least one support (2) and a light-emitting diode (3) which is arranged thereon. Said support (2) comprises a plurality of superimposed polymer layers (4, 5, 6). At least one polymer layer (4, 5, 6) comprises a recess (8) in which an electric component (7, 17, 18, 19) is embedded.