LED Package Emission Height Matching Across Color Channels
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Solution Overview
Problem
Conventional LED packages face challenges in achieving high light emission efficiency and uniformity due to variations in lumiphoric materials and cover structures, leading to non-uniform light emissions when different LED chips with varying heights are assembled in close proximity.
Innovation Solution
The solution involves configuring LED chips with different heights or thicknesses to compensate for variations in lumiphoric materials and cover structures, ensuring that emission heights are within specific tolerances (e.g., within 100 microns) to achieve uniformity across LED packages with different emission colors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If LED chips with different heights are assembled in close proximity to provide different emission colors, then the variety of emission colors is improved, but the uniformity of light emissions deteriorates
Solution Approach 1:
The patent applies local quality by configuring different LED chips with specific heights and thicknesses tailored to their individual lumiphoric material requirements. Each LED chip is locally optimized with precise thickness control to compensate for variations in lumiphoric material thickness, ensuring that despite different emission colors, all chips achieve uniform emission heights when assembled together.
2Manufacturing precision
If LED chips with varying thicknesses are used to compensate for lumiphoric material variations, then the emission height uniformity is improved, but the device complexity increases
Solution Approach 1:
The patent employs parameter changes by systematically varying the thickness parameter of LED chips to compensate for lumiphoric material thickness variations. By controlling and adjusting the thickness parameter of each LED chip based on its specific lumiphoric material requirements, the invention achieves uniform emission heights across different emission colors while managing device complexity through a systematic parameter adjustment approach.
3Productivity
If conventional LED packages are assembled with different chip heights, then the production efficiency is maintained, but the light emission uniformity deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-configuring LED chips with specific heights and thicknesses before assembly. The thickness of each LED chip is determined in advance based on the required compensation for its lumiphoric material variations, allowing for efficient assembly processes while ensuring emission height uniformity is achieved before the chips are mounted in their final positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the uniformity of light emissions by ensuring that emission heights are closely matched, improving the overall light output consistency and efficiency of LED packages with multiple emission colors.
Implementation Method 1
Lumiphoric materials, such as phosphors, may be arranged in light emission paths of LED emitters to convert portions of light to different wavelengths
Data Source
AI summary
Light-emitting diode (LED) packages and more particularly emission height arrangements in LED packages and related devices and methods are disclosed. LED packages, LED chips, and related device arrangements are disclosed that include various combinations of LED chip types, lumiphoric materials, and/or cover structures that are arranged together while also providing a substantially uniform emission height for corresponding light-emitting surfaces. LED chips may be configured with different heights or thicknesses that compensate for variations in lumiphoric materials and/or cover structures utilized to provide different emission colors. Corresponding LED packages and/or LED chips with different emission colors may be assembled near one another with improved emission height uniformity.