LED Light Emitter Ceramic Substrate Edge Traces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light emitter components, such as LED chips attached to printed circuit boards, face challenges in reducing manufacturing costs and enhancing optical efficiency due to expensive materials and interference with light emission.
Innovation Solution
The design incorporates a substrate with shorter, strategically placed electrical traces at the edges and a string of LED chips spaced apart from these traces, using less expensive materials like gold, silver, or copper wires for connections, and a ceramic substrate for improved light extraction and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LED chips are attached directly to PCB or MCPCB surfaces, then electrical connections are established, but manufacturing costs increase and optical efficiency decreases due to expensive materials and light interference
Solution Approach 1:
The patent extracts and removes the problematic PCB/MCPCB substrate and metallic traces from the light emission area. By using a non-conductive ceramic panel without extensive metallic plating, the design eliminates the sources of light absorption and interference, allowing light to pass through unobstructed while maintaining electrical functionality through selective trace placement only at edges.
Solution Approach 2:
The patent replaces expensive MCPCB materials with a simpler, less costly ceramic panel that does not require extensive metallic plating. This substitution reduces material costs while achieving the same functional goals of electrical connection and light transmission, making the overall component more cost-effective.
2Reliability
If electroplating traces are deposited down the entire length of the panel, then electrical connections are established, but manufacturing cost increases due to metallic plating materials and processing equipment
Solution Approach 1:
The patent removes the need for extensive full-length electroplated traces by placing ceramic panels edge-to-edge and establishing electrical connections only at the outermost edges. This extraction of traces from the central light-emitting area eliminates the need for costly full-panel metallic plating while maintaining reliable electrical connectivity through the remaining edge traces and wire bonds.
Solution Approach 2:
The patent segments the electrical connection function into discrete components: edge traces for initial connection, wire bonds for inter-chip connectivity, and minimal trace placement only where absolutely necessary at panel edges. This segmentation eliminates the need for continuous full-length traces, reducing material and processing costs while maintaining electrical reliability.
3Reliability
If metallic traces are used for electrical connections, then electrical conductivity is achieved, but optical efficiency decreases due to light absorption and interference
Solution Approach 1:
The patent extracts metallic traces from the light emission path and confines them to panel edges only. By removing traces from the central area where light is generated and emitted, the design eliminates light absorption and interference while maintaining electrical conductivity through edge-based connections and wire bonding.
Solution Approach 2:
The patent introduces wire bonds as an intermediary element to establish electrical connections between LED chips without requiring extensive metallic traces across the panel. These wire bonds provide the necessary electrical connectivity while occupying minimal space and causing negligible light interference compared to full-length traces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in brighter, more cost-effective light emitter components with improved optical efficiency and reduced material consumption, allowing for the same or increased brightness with fewer LED chips, thus lowering production costs.
Implementation Method 1
Light emitters, such as light emitting diodes (LEDs) or LED chips are solid state devices that convert electrical energy into light
Implementation Method 2
components described herein can advantageously exhibit improved reflection, improved brightness, improved light extraction
Data Source
AI summary
Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.