LED Encapsulant Filtering for NVIS Compliance

Solution Overview

Problem

Existing NVIS-compliant lighting systems require external filtering materials, which increase manufacturing time and expense, and are prone to wear and tear, as they need external coatings or bonding of filtering agents to LEDs.

Innovation Solution

Incorporating filtering material, such as absorbers and phosphor, into the encapsulant or housing of LEDs to achieve internal filtering, eliminating the need for external filtering agents and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external filtering materials are used to achieve NVIS compliance, then the lighting system meets night vision imaging standards, but manufacturing time and expense increase

Engineering Contradiction:

ImproveNVIS complianceVSAvoidmanufacturing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent combines the filtering function with the encapsulant material that already surrounds the LED die. By incorporating infrared-absorbing particles directly into the encapsulant, the design merges two separate components (LED + external filter) into a single integrated unit, eliminating the need for separate filtering materials and reducing manufacturing steps

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulant material is given multiple functions: it continues to protect the LED die while simultaneously providing infrared filtering capability. This multi-functionality eliminates the need for separate filtering components and simplifies the overall structure

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If external filtering materials are used to achieve NVIS compliance, then the lighting system meets night vision imaging standards, but manufacturing expense increases

Engineering Contradiction:

ImproveNVIS complianceVSAvoidmanufacturing expense

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the filtering function with the encapsulant material that already surrounds the LED die. By incorporating infrared-absorbing particles directly into the encapsulant, the design merges two separate components (LED + external filter) into a single integrated unit, eliminating the need for separate filtering materials and reducing manufacturing steps

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The encapsulant material is given multiple functions: it continues to protect the LED die while simultaneously providing infrared filtering capability. This multi-functionality eliminates the need for separate filtering components and simplifies the overall structure

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The internal filtering solution reduces manufacturing costs and enhances durability by ensuring NVIS compliance without external coatings, making the LEDs ready for use in NVIS environments with reduced risk of wear and tear.

Implementation Method 1

a conformal coating covering the printed circuit board assembly, including an absorbing agent, for filtering quantities of energy of the emission, such that the infrared emission of the printed circuit board assembly is filtered by the absorbing agent

Methodology Applied

Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Implementation Method 2

The preferred result, in any event, is an NVIS-compliant LED ready for installation and use

Methodology Applied

Scientific EffectPhotoluminescence: Photoluminescence

Data Source

PatentUS8523372B2Lighting systems

Publication Date: 2013.09.03 IDD AEROSPACE CORP

AI summary

Assemblies compliant with night vision imaging system (NVIS) standards are described. Versions of the assemblies incorporate filtering material into an encapsulant for a light-emitting diode (LED) die, avoiding any necessity of using external filtering agents. Alternatively or additionally, filtering material may be incorporated into a housing of an encapsulated LED.