LED Package Encapsulant Structure to Prevent Cleaning Peel-Off
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Solution Overview
Problem
The luminous efficiency of LEDs in display panels is affected by incomplete cleaning or degumming during manufacturing processes, leading to damage in the display area.
Innovation Solution
A package structure comprising a circuit substrate, a light emitting diode array, a first encapsulant with a main and extension portion, and a sealant, where the encapsulant forms a coplanar surface with the sealant, and the sealant provides good adhesion to prevent peeling during cleaning operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the black encapsulant is removed during cleaning process, then the luminous efficiency of LEDs is improved, but the encapsulant side edge may peel (degumming) causing damage to the display area
Solution Approach 1:
The encapsulant is divided into two distinct parts: a main body portion covering the LED and an extension portion that reaches the circuit substrate. This segmentation allows the main body to be removed for luminous efficiency while the extension portion remains to maintain adhesion and prevent peeling during cleaning processes.
Solution Approach 2:
The extension portion of the encapsulant is designed in advance to extend to the circuit substrate before cleaning operations. This preliminary structural arrangement ensures that during subsequent cleaning processes, the extension portion provides anchoring that prevents the main encapsulant body from peeling off, thus protecting the display area while allowing effective removal of the black encapsulant material.
2Manufacturing precision
If the encapsulant is completely removed to improve cleaning quality, then luminous efficiency increases, but the risk of display panel damage increases
Solution Approach 1:
By segmenting the encapsulant into removable main body and retained extension portion, the design enables complete removal of the black encapsulant material from the LED surface for high cleaning quality, while the extension portion remains attached to the circuit substrate to prevent any peeling that could damage the display panel.
Solution Approach 2:
The extension portion acts as an intermediary element between the removable main encapsulant body and the circuit substrate. It provides a secure anchor point that prevents peeling during cleaning operations, thereby protecting the display area from damage while allowing the main body to be completely removed for optimal luminous efficiency.
3Reliability
If the encapsulant extends to the circuit substrate to prevent peeling, then adhesion is improved, but the structure complexity increases
Solution Approach 1:
The encapsulant is segmented into a main body portion and an extension portion, where the extension portion naturally extends to the circuit substrate to provide adhesion. This segmentation achieves improved reliability through a relatively simple structural division rather than complex multi-component assemblies.
Data Source
AI summary
A package structure includes a circuit substrate, a light emitting diode array, a first encapsulant, and a sealant. The circuit substrate includes a top surface and a side surface of the circuit substrate. The light emitting diode array is disposed on the top surface of the circuit substrate. The first encapsulant is disposed above the circuit substrate. The first encapsulant includes a main portion and an extension portion, in which the main portion of the first encapsulant is disposed parallel to the top surface of the circuit substrate, and the extension portion of the first encapsulant extends to the side surface of the circuit substrate. The sealant is disposed below the extension portion of the first encapsulant, and the sealant contacts the first encapsulant and the circuit substrate. The first encapsulant and the sealant together form a coplanar surface.