LED Package Encapsulant Composite to Prevent Resin Cracking
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Solution Overview
Problem
Light emitting diode packages face reliability issues due to cracking of the light transmissive resin caused by thermal expansion mismatch between the resin and the LED chip, leading to deterioration in luminous efficacy and package reliability.
Innovation Solution
Incorporating reinforcing fillers with a low coefficient of thermal expansion, such as glass fibers, into the light transmissive resin to prevent cracking and improve reliability, while maintaining luminous efficacy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a light transmissive resin is used to cover the light emitting diode chip, then the LED chip is protected, but cracks may be generated in the resin due to thermal expansion mismatch between the resin and the LED chip
Solution Approach 1:
The patent applies composite materials by combining the light transmissive resin with reinforcing fillers (such as glass fibers, silica, or alumina) to create a composite encapsulant. This composite structure provides both the light transmissive properties needed for LED operation and the mechanical strength to resist cracking from thermal expansion mismatch. The reinforcing fillers form a network within the resin matrix that prevents crack propagation while maintaining optical transparency.
Solution Approach 2:
The patent changes the physical and chemical parameters of the encapsulant material by selecting resins with specific glass transition temperatures, molecular weights, and crosslinking densities. These parameter adjustments optimize the resin's thermal expansion coefficient to better match the LED chip, reducing thermal stress. The reinforcing fillers further modify parameters such as tensile strength, elongation at break, and thermal conductivity to prevent cracking while maintaining reliability.
2Reliability
If reinforcing fillers are added to the light transmissive resin to prevent cracking, then reliability is improved, but luminous efficacy may deteriorate
Solution Approach 1:
The patent applies local quality by strategically selecting filler materials and distributions that provide crack resistance only where needed (in the structural matrix) while maintaining optical clarity in the light transmission path. The reinforcing fillers are dispersed throughout the resin matrix to provide mechanical strength, but their concentration and type are optimized to minimize light scattering and absorption. Different filler materials (glass fibers, silica, alumina) are chosen based on their specific optical and mechanical properties to balance these requirements.
Solution Approach 2:
The patent employs inexpensive, inert filler materials such as glass fibers, silica, and alumina that provide durable mechanical reinforcement without degrading over time. These fillers are selected for their chemical stability, low cost, and ability to maintain structural integrity under thermal cycling, while their optical properties (transparency or appropriate refractive index) ensure they do not significantly impede light transmission or reduce luminous efficacy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of reinforcing fillers significantly delays crack generation in the light transmissive resin, enhancing the reliability and longevity of the LED package while minimizing luminous efficacy deterioration.
Implementation Method 1
the light transmissive resin has a higher coefficient of thermal expansion than the light emitting diode chip. Accordingly, the light transmissive resin undergoes significant expansion or contraction due to temperature variation
Implementation Method 2
A light emitting diode emits light having various wavelengths through recombination of holes and electrons in a junction region of p-type and n-type semiconductors upon application of electric current thereto
Data Source
AI summary
A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.


