LED Package Encapsulant Composite to Prevent Resin Cracking

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Solution Overview

Problem

Light emitting diode packages face reliability issues due to cracking of the light transmissive resin caused by thermal expansion mismatch between the resin and the LED chip, leading to deterioration in luminous efficacy and package reliability.

Innovation Solution

Incorporating reinforcing fillers with a low coefficient of thermal expansion, such as glass fibers, into the light transmissive resin to prevent cracking and improve reliability, while maintaining luminous efficacy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a light transmissive resin is used to cover the light emitting diode chip, then the LED chip is protected, but cracks may be generated in the resin due to thermal expansion mismatch between the resin and the LED chip

Engineering Contradiction:
Improvecrack resistanceVSAvoidresin structural integrity
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent applies composite materials by combining the light transmissive resin with reinforcing fillers (such as glass fibers, silica, or alumina) to create a composite encapsulant. This composite structure provides both the light transmissive properties needed for LED operation and the mechanical strength to resist cracking from thermal expansion mismatch. The reinforcing fillers form a network within the resin matrix that prevents crack propagation while maintaining optical transparency.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the physical and chemical parameters of the encapsulant material by selecting resins with specific glass transition temperatures, molecular weights, and crosslinking densities. These parameter adjustments optimize the resin's thermal expansion coefficient to better match the LED chip, reducing thermal stress. The reinforcing fillers further modify parameters such as tensile strength, elongation at break, and thermal conductivity to prevent cracking while maintaining reliability.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If reinforcing fillers are added to the light transmissive resin to prevent cracking, then reliability is improved, but luminous efficacy may deteriorate

Engineering Contradiction:
Improvecrack resistanceVSAvoidluminous efficacy
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent applies local quality by strategically selecting filler materials and distributions that provide crack resistance only where needed (in the structural matrix) while maintaining optical clarity in the light transmission path. The reinforcing fillers are dispersed throughout the resin matrix to provide mechanical strength, but their concentration and type are optimized to minimize light scattering and absorption. Different filler materials (glass fibers, silica, alumina) are chosen based on their specific optical and mechanical properties to balance these requirements.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs inexpensive, inert filler materials such as glass fibers, silica, and alumina that provide durable mechanical reinforcement without degrading over time. These fillers are selected for their chemical stability, low cost, and ability to maintain structural integrity under thermal cycling, while their optical properties (transparency or appropriate refractive index) ensure they do not significantly impede light transmission or reduce luminous efficacy.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of reinforcing fillers significantly delays crack generation in the light transmissive resin, enhancing the reliability and longevity of the LED package while minimizing luminous efficacy deterioration.

Implementation Method 1

the light transmissive resin has a higher coefficient of thermal expansion than the light emitting diode chip. Accordingly, the light transmissive resin undergoes significant expansion or contraction due to temperature variation

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

A light emitting diode emits light having various wavelengths through recombination of holes and electrons in a junction region of p-type and n-type semiconductors upon application of electric current thereto

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS12199226B2Light emitting package free of wavelength conversion material
Publication Date: 2025.01.14 SEOUL SEMICONDUCTOR
  • US12199226B2 patent drawing
  • US12199226B2 patent drawing
  • US12199226B2 patent drawing

AI summary

A light emitting diode package is disclosed. The light emitting diode package includes a light emitting diode chip emitting light and a light transmissive member. The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin and reinforcing fillers. The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.