LED Encapsulation Structure for Adhesion and Environmental Protection
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Solution Overview
Problem
Existing light emitting devices have reliability issues due to the configuration of light emitting elements, substrates, and connecting wires, which can lead to adhesion problems and exposure to dust, moisture, and external forces.
Innovation Solution
A light emitting device configuration that includes a light emitting element, a first substrate with an element placement region, a light-transmissive member covering the element, and a first protrusion portion along the outer edge of the light-transmissive member, which extends across the substrate and the light-transmissive member, improving adhesion and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If light emitting elements are arrayed on a submount and connected via wires, then the device can be manufactured with standard processes, but adhesion problems and exposure to dust, moisture, and external forces reduce reliability
Solution Approach 1:
A light-transmissive member in the form of a thin film or shell covers the light emitting elements and wire connections, creating a protective barrier against dust, moisture, and external forces while allowing light to pass through. This encapsulation approach maintains reliability by isolating sensitive components from harmful environmental factors.
Solution Approach 2:
The invention transitions from a planar arrangement of components to a three-dimensional structure where the light-transmissive member covers and encapsulates the components. This dimensional change creates protective coverage over the wire connections and light emitting elements, shielding them from environmental harm while maintaining electrical and optical functionality.
2Object-affected harmful factors
If the light-transmissive member covers the light emitting element, then protection from environmental factors is improved, but adhesion between the member and substrate may be insufficient
Solution Approach 1:
The light-transmissive member is divided into multiple regions with different functions: a coverage region that protects the light emitting elements and wire connections from environmental factors, and an adhesion region that bonds to the substrate. This segmentation allows each region to be optimized for its specific purpose, ensuring both protection and strong adhesion.
Solution Approach 2:
Different regions of the light-transmissive member have different properties: the coverage region is designed for environmental protection with appropriate optical and protective characteristics, while the adhesion region has enhanced bonding properties to ensure strong attachment to the substrate. This local differentiation of properties resolves the contradiction between protection and adhesion.
3Ease of manufacture
If wire connections are exposed, then manufacturing and assembly are simplified, but the connections are vulnerable to external forces and environmental damage
Solution Approach 1:
The light-transmissive member extends into the third dimension to cover the wire connections that are arranged in a planar manner. This dimensional extension provides protective coverage over the connections without complicating the manufacturing process, as the member can be applied as a single encapsulating layer that simultaneously protects multiple components.
Solution Approach 2:
The invention merges the protection function with the structural configuration by designing the light-transmissive member to simultaneously cover the light emitting elements and the wire connections. This unified approach protects both exposed components without requiring separate protective structures, maintaining ease of manufacture while improving reliability.
Data Source
AI summary
A light emitting device includes: a first substrate; a light emitting element disposed on a first region of an upper surface of the first substrate; a light-transmissive member including disposed as a layer including a first portion that is located on an upper surface of the light emitting element and a second portion that is continuous with the first portion and is located on a second region of the upper surface of the first substrate; and a protrusion extending around the light emitting element. Part of the second portion of the light-transmissive member is located between the protrusion and the second region of the upper surface of the first substrate.


