LED Encapsulation with Thermo-Electric Cooling
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Solution Overview
Problem
Light emitting diodes (LEDs) face challenges with heat dissipation during operation, which affects their luminescence and lifetime, necessitating an effective method to manage thermal issues in high-power electronic devices.
Innovation Solution
Integration of a thermo-electric element with a metal printed circuit board (PCB) using a method that includes forming electrodes, attaching the PCB to a metal substrate, and incorporating a light emitting diode on the thermo-electric element, optionally with additional layers and heat dissipation modules for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional passive cooling fins are used, then the structure is simple, but heat dissipation efficiency is insufficient for high-power devices
Solution Approach 1:
The patent replaces passive mechanical cooling fins with an active thermoelectric cooling system that uses electrical energy to drive heat transfer. The thermoelectric element converts electrical energy into thermal energy gradients, actively pumping heat away from the LED, thereby achieving superior heat dissipation efficiency for high-power devices while maintaining manufacturing feasibility through standardized component integration.
2Loss of energy
If active thermoelectric cooling is implemented, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The patent merges the thermoelectric element directly with the LED assembly and PCB structure, integrating multiple functions into a unified device. The thermoelectric element is positioned in thermal contact with the LED heat source, and its electrical connections are integrated into the PCB circuitry, thereby reducing the number of separate components and simplifying the overall device structure despite the advanced cooling functionality.
Solution Approach 2:
The PCB serves multiple functions: it provides electrical connections for the LED and thermoelectric element, acts as a mechanical support structure, and functions as part of the thermal management system through integrated heat dissipation pathways. This multi-functionality reduces the need for separate dedicated components, thereby managing device complexity while achieving effective heat dissipation.
3Device complexity
If heat dissipation is not adequately managed, then device structure remains simple, but LED luminescence and lifetime deteriorate
Solution Approach 1:
The patent implements preliminary thermal management by integrating the thermoelectric cooling element before the LED operates at high power. The cooling system is pre-positioned and thermally coupled to the LED heat source, establishing optimal thermal conditions before heat accumulation occurs, thereby protecting LED luminescence and lifetime from the outset rather than attempting to manage heat after damage has occurred.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration significantly enhances heat dissipation efficiency, leading to improved device performance by increasing luminescence and extending the lifetime of LEDs, while the addition of a heat dissipation module achieves advanced thermal management.
Implementation Method 1
A thermo-electric element, also called a cooling device, utilizes active cooling techniques
Implementation Method 2
a metal PCB is widely used by IC or light emitting diode manufactures due to the heat dissipation efficiency thereof
Data Source
AI summary
The invention discloses an encapsulation comprising a metal substrate, a PCB on the metal substrate, a thermo-electric element in and/or on the PCB, and an LED on the thermo-electric element. Encapsulating methods are also provided by the invention.