LED Encapsulation Structure for Small-Pixel Transfer Yield

The patent divides the light emitting device into multiple independent sub-pixels (red, green, blue) that can be manufactured separately on the same substrate. Each sub-pixel has its own circuit structure and light emitting diode, allowing independent processing and transfer. This segmentation enables higher process yield by reducing the complexity of manufacturing and transferring all sub-pixels simultaneously as a single unit.

The patent introduces a transfer substrate as an intermediary component between the manufacturing process and the final device assembly. The light emitting diodes are first manufactured on a carrier substrate, then transferred to a transfer substrate that provides temporary support and protection during handling and transfer operations. This intermediary substrate protects the fragile small-sized diodes and circuit structures from damage during the transfer process, thereby improving process yield.

The patent applies a protective layer over the circuit structure before the light emitting diodes are fully assembled and electrically connected. This protective layer is applied in advance to protect the exposed circuit structures from damage during subsequent manufacturing steps such as bonding, cutting, and handling. The protective layer is later removed or opened to expose the circuit structures for electrical connection, thus preventing damage while enabling ease of manufacture.

The protective layer serves as a cushioning barrier that absorbs mechanical stresses and prevents direct contact between external forces and the fragile circuit structures during manufacturing operations. This beforehand cushioning protects the circuit structures from damage while allowing necessary manufacturing processes to proceed.