LED Package ESD Protection Separate Cavities
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Solution Overview
Problem
Conventional LED package structures suffer from reduced luminance efficiency due to the placement of Zener diodes, which are used for electrostatic discharge protection and block light emission.
Innovation Solution
The LED and ESD protection device are placed in separate cavities within the package structure, allowing the ESD protection device to be electrically connected to the leads without obstructing the light emitted by the LED, using a design that includes multiple leads and encapsulant cavities to optimize light path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the Zener diode is disposed on the second lead within the same cavity as the LED chip, then the LED is protected from ESD damage, but the Zener diode blocks parts of the light emitted by the LED chip, deteriorating luminance efficiency
Solution Approach 1:
The encapsulant is divided into multiple cavities (first cavity and second cavity) to separate the LED chip and Zener diode spatially. The LED chip is disposed in the first cavity while the Zener diode is disposed in the second cavity, allowing both components to coexist without light interference while maintaining ESD protection functionality.
Solution Approach 2:
The patent transitions from a single-cavity two-dimensional layout to a multi-cavity three-dimensional structure. By utilizing vertical or lateral separation into distinct cavities within the encapsulant, the design allows the Zener diode to be positioned out of the light path while maintaining electrical connection to the LED for ESD protection.
Data Source
AI summary
A package structure including a first lead, a second lead, an encapsulant, a light-emitting device and an electrostatic discharge (ESD) protection device is provided. The second lead is disposed beside the first lead, and parts of the first lead and the second lead are encapsulated by the encapsulant. The encapsulant has a first cavity and a second cavity. Parts of the first lead and the second lead are exposed by the first cavity and the other parts of the first lead and the second lead are exposed by the second cavity. The light-emitting device is disposed inside the first cavity and electrically connected to the first lead and the second lead. The ESD protection device is disposed inside the second cavity and electrically connected to the first lead and the second lead.