Light-emitting Device Electrostatic Protection Substrate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light-emitting devices require additional space and processing for a Zener diode to divert static electricity, which complicates their design and functionality.
Innovation Solution
A light-emitting device that incorporates a substrate with a first and second variable resistor, an insulation portion, and a carrier, where the resistors and insulation portion penetrate the substrate to create an electrostatic diverter that isolates the light-emitting element from static electricity without occupying extra space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a Zener diode is added to divert static electricity, then the light-emitting device gains electrostatic protection, but the device occupies more space and requires additional processing
Solution Approach 1:
The substrate integrates multiple functions: it serves as both the mounting platform for the light-emitting element and as an electrostatic diverter through embedded variable resistors. This merging of structural and protective functions eliminates the need for separate Zener diode components, thereby protecting against static electricity while occupying minimal space.
Solution Approach 2:
The substrate is designed with multi-functionality, acting simultaneously as a mechanical support structure and an electrostatic protection system. The variable resistors are incorporated directly into the substrate layers, enabling the substrate to perform both structural and electrostatic diversion roles without requiring additional dedicated components.
2Reliability
If a Zener diode is added to divert static electricity, then the light-emitting device gains electrostatic protection, but the manufacturing process becomes more complex
Solution Approach 1:
The electrostatic protection components (variable resistors) are merged into the substrate manufacturing process itself. The substrate is formed with embedded variable resistors as integral parts of its layered structure, eliminating the need for separate assembly steps for installing Zener diodes and simplifying the overall manufacturing process.
Solution Approach 2:
The variable resistors are incorporated into the substrate during the substrate formation process itself, before the light-emitting element is mounted. This preliminary integration of protective components into the base structure eliminates subsequent assembly steps and reduces manufacturing complexity.
3Area of stationary object
If variable resistors and insulation portion penetrate the substrate, then electrostatic diversion is achieved with minimal space, but the substrate structure becomes more complex
Solution Approach 1:
The variable resistors and insulation portions are arranged in vertical layers that penetrate through the substrate thickness, utilizing the third dimension (depth) rather than expanding the horizontal footprint. This vertical integration allows electrostatic protection components to be embedded within the substrate volume, achieving minimal space occupation while maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively diverts static electricity without damaging the light-emitting element, while reducing the device's overall size and simplifying the manufacturing process by using variable resistors and an insulation portion to manage transient voltage.
Implementation Method 1
The first variable resistor, the second variable resistor and the insulation portion respectively penetrate the substrate
Data Source
AI summary
A light-emitting device is provided. The light-emitting device comprises a substrate and a light-emitting element. The substrate comprises a first variable resistor, a second variable resistor, an insulation portion and a carrier. The insulation portion is located between the first variable resistor and the second variable resistor. The carrier is surrounded by the insulation portion, and the light-emitting element is disposed on the carrier. The first variable resistor, the second variable resistor and the insulation portion respectively penetrate the substrate.