LED with Exposed Metal Pads and Direct Fluorescent Layer
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Solution Overview
Problem
Current LEDs face stress issues during packaging due to the use of fluorescent powders, which can lead to packaging problems and inefficiencies.
Innovation Solution
A light-emitting diode (LED) design with exposed metal pads and a fluorescent layer that directly contacts the pads, allowing for direct packaging without the need for coating fluorescent powders, and using different materials for the fluorescent layer and packaging glue to reduce stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If fluorescent powders are coated in the package during packaging process, then light mixing can be achieved, but stress problem occurs in the packaged LED
Solution Approach 1:
The patent extracts the fluorescent powder coating process from the packaging process. Instead of coating fluorescent powders in the package during packaging, the invention uses a fluorescent layer formed directly on the LED die surface, separating the light mixing function from the packaging process and eliminating the associated stress problems.
Solution Approach 2:
The patent introduces a fluorescent layer as an intermediary substance formed on the LED die surface. This fluorescent layer serves as the mediator for light mixing, replacing the need for fluorescent powder coating in the package and eliminating the stress issues associated with the traditional packaging method.
2Ease of manufacture
If metal pads are covered, then packaging can be simplified, but subsequent wiring and packaging processes become difficult
Solution Approach 1:
The patent applies local quality by selectively exposing metal pads only in specific areas where wiring is needed, while other areas can be covered. This allows the packaging to be simplified in non-wiring areas while maintaining ease of operation in wiring areas through localized pad exposure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables convenient wiring and packaging processes while reducing stress and packaging inefficiencies, allowing for efficient light mixing and extended LED lifespan.
Implementation Method 1
The fluorescent layer is disposed on a surface of the LED die. The fluorescent layer directly contacts with the side surfaces of the metal pads and fills a gap between the metal pads.
Data Source
AI summary
A light-emitting diode (LED) is provided. An LED die includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a first electrode and a second electrode. At least a part of the first semiconductor is exposed from the light emitting layer and the second semiconductor layer. The first electrode and the second electrode is disposed on top of the exposed first semiconductor layer and the second semiconductor layer respectively. At least two metal pads are disposed on top of the first electrode and the second electrode of the LED die respectively. Each of the metal pads has a side surface. A fluorescent layer is disposed on a surface of the LED die. The fluorescent layer directly contacts with the side surfaces of the metal pads and fills a gap between the metal pads.