LED Lighting Device Exposed Region Heat Dissipation
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Solution Overview
Problem
High-brightness LED lighting devices face heat dissipation issues due to the occupation of space by wiring substrates, which limits the size reduction of the device and reduces the effectiveness of heat discharge from the substrate.
Innovation Solution
The LED lighting device features an exposed region on the mounting substrate for heat dissipation and separate wiring regions on the outer side of the light emitting area, allowing for efficient heat discharge from both the upper and lower surfaces, with the wiring regions minimized to maximize heat discharge efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring substrates are provided on the mounted substrate to enable electrical connections, then electrical connectivity is improved, but the heat discharge effect of the mounted substrate is reduced and device size increases
Solution Approach 1:
The patent divides the mounted substrate into distinct functional regions: a light emitting region for LED mounting, an exposed region for heat discharge, and separate wiring regions for electrical connections. This spatial segmentation allows each region to perform its function optimally without interfering with others, resolving the contradiction between electrical connectivity and heat discharge effectiveness
Solution Approach 2:
The patent utilizes the upper surface of the mounted substrate as an additional dimension for heat discharge by creating an exposed region that directly exposes the thermally conductive substrate to external air. This three-dimensional heat dissipation approach (through lower surface + upper surface exposure) overcomes the limitation of planar wiring substrate placement
2Reliability
If wiring substrates are enlarged to secure sufficient space for electrical connections, then electrical connectivity is improved, but the device size increases and heat discharge efficiency is reduced
Solution Approach 1:
The patent segments the mounted substrate into functionally independent regions, allowing wiring regions to be minimized to only the extent necessary for electrical connections, while the remaining area is allocated to the exposed region for heat discharge. This segmentation enables compact device design without compromising electrical connectivity
Solution Approach 2:
The patent applies different functional qualities to different regions of the mounted substrate: the wiring regions are optimized for electrical connectivity with appropriate conductor traces, while the exposed region is optimized for heat discharge with direct thermal exposure. This local differentiation allows each region to be sized appropriately for its specific function, minimizing overall device size
3Illumination intensity
If the number of LED elements is increased to achieve higher brightness, then illumination intensity is improved, but heat generation increases requiring larger heat dissipation area
Solution Approach 1:
The patent creates an exposed region on the upper surface of the mounted substrate that directly exposes the thermally conductive substrate to external air, adding a third dimension to heat dissipation (through lower surface + upper surface exposure). This increased heat dissipation surface area enables higher LED density and brightness without proportional increases in device size
Solution Approach 2:
The patent uses the mounted substrate itself as a dual-function component: it serves as both the mounting platform for LED elements and as a heat dissipation structure through its exposed upper surface. This eliminates the need for separate heat sink structures, allowing compact high-brightness device design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces heat generation in the light emitting region by allowing direct heat discharge from the upper surface to external air, enhancing the overall heat dissipation and enabling a more compact device design.
Implementation Method 1
a metal material, a ceramics material, or another material that has high thermal conductivity is used as a mounted substrate on which LED elements are mounted
Implementation Method 2
Through the exposed region, heat emitted from the LED elements is released outside the LED lighting device
Data Source
Figure 1(a)~1(b)
Figure 2~3
Figure 4
AI summary
An LED lighting device is provided that is capable of discharging heat generated from a light emitting element to the outside the LED lighting device. An LED lighting device (11) includes: a plurality of light emitting elements (15); a mounted substrate (12) on which the light emitting elements (15) are mounted; and an electrode portion (26) configured to supply a current to the light emitting elements (15) from outside the LED lighting device (11). On the mounted substrate (12), a wiring substrate (13, 14) is located. On the upper surface of the mounted substrate (12), the mounted substrate (12) includes: a light emitting region (21) in which the plurality of light emitting elements (15) are mounted; an exposed region (22) which is located on the outer side of the light emitting region (21) and through which the upper surface of the mounted substrate (12) is exposed; and a wiring region (23) which is located on the outer side of the light emitting region (21) and in which the wiring substrate (13, 14) is located.