LED Module Fan-Out Interconnection for Protected Display Layouts
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Solution Overview
Problem
Current LED modules lack design flexibility and protection, particularly in the interconnection structure, which affects the efficiency and reliability of light emission in display devices.
Innovation Solution
A multi-layer LED module structure incorporating a substrate, LEDs, upper electrodes, an insulating layer, and a film on glass (FOG) electrode with a fan-out interconnection structure that connects the electrodes through the insulating layer, providing protection and efficient light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a traditional LED module structure is used, then the manufacturing process is simpler, but the design freedom and protection of the LED module are reduced
Solution Approach 1:
The patent divides the LED module into distinct functional layers: a substrate layer, an insulating layer, and a fan-out interconnection structure layer. This segmentation allows independent optimization of each layer, providing design freedom while maintaining manufacturing feasibility through standardized layering processes.
Solution Approach 2:
The patent transitions from a planar interconnection structure to a three-dimensional multi-layer structure by introducing vertical stacking of insulating layers and fan-out interconnections. This dimensional change enables enhanced protection and design flexibility without significantly increasing lateral footprint, resolving the contradiction between complexity and adaptability.
2Reliability
If the interconnection structure is integrated with LED connections, then the structure is more compact, but the protection and reliability of the LED module are reduced
Solution Approach 1:
The patent extracts the interconnection structure from the LED connection structure by introducing a separate fan-out interconnection layer. This separation allows the interconnection structure to be independently optimized for reliability while maintaining compact integration through vertical stacking, resolving the contradiction between reliability and complexity.
Solution Approach 2:
The insulating layer acts as an intermediary between the substrate and the fan-out interconnection structure, providing electrical isolation and mechanical support. This intermediary element enables reliable separate interconnections while maintaining overall structural compactness, addressing the contradiction between reliability and device complexity.
3Reliability
If an insulating layer is added to protect the LED, then the protection and reliability are improved, but the light emission efficiency may be reduced
Solution Approach 1:
The patent applies the insulating layer selectively in regions where electrical isolation is needed, rather than uniformly across the entire LED structure. This localized application provides necessary protection while minimizing interference with light emission paths, resolving the contradiction between protection and light emission efficiency.
Solution Approach 2:
The patent employs thin film insulating layers that provide adequate electrical protection and mechanical support while maintaining high optical transparency. These thin films minimize light absorption and scattering, ensuring that protection does not significantly reduce light emission efficiency, thus resolving the contradiction between reliability and energy efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances design freedom and protection of the LED module, ensuring efficient light emission and improved reliability by separating the interconnection structure from the LED connections and using an insulating layer for protection and efficient power supply.
Implementation Method 1
LEDs are devices that convert electrical signals into forms of light, such as infrared rays and visible light using the characteristics of compound semiconductors
Data Source
AI summary
Provided are a light emitting diode (LED) module that enables a freedom in structure design thereof using a fan-out interconnection and an insulating layer, and a display device having the same. The LED module having a multi-layer structure includes substrate; a LED located on the substrate and emitting light toward the substrate; a plurality of upper electrodes located on the LED and connected to the LED; an upper insulating layer provided to surround the plurality of upper electrodes; a film on glass (FOG) electrode located on the upper insulating layer; and a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer.