LED Filament Thermal Management via Composite Substrates

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Solution Overview

Problem

Conventional LED light bulbs suffer from inadequate heat conductivity in their filament supports, leading to inefficient heat dissipation and radiation.

Innovation Solution

The LED light bulb design incorporates a transparent housing with a screw base, filament supports featuring metal posts coated with graphene or borazon for enhanced thermal conductivity, and LED filaments with a thermal radiation film on the substrate, allowing for improved heat dissipation and radiation through a series connection of LED chips and a black body radiation layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If glass filament support is used, then electrical insulation is achieved, but heat conductivity is insufficient

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidelectrical insulation performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent applies composite materials by combining metal (for thermal conductivity) and electrical insulation coatings or ceramic materials (for electrical insulation) in the filament support structure. This creates a composite component that simultaneously achieves both heat dissipation and electrical insulation requirements.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent implements local quality by applying electrical insulation coatings only in specific areas where electrical insulation is needed, while maintaining high thermal conductivity in the bulk metal structure. This allows different regions of the same component to have different functional properties.

Inventive Principle:

Principle #3Local quality

2Use of energy by moving object

If conventional LED filament structure is used, then manufacturing simplicity is maintained, but radiation efficiency is insufficient

Engineering Contradiction:

Improveradiation efficiencyVSAvoidfilament structure complexity

Core Design Contradiction:

Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The patent applies color changes by incorporating a black body radiation layer that optimizes the spectral emission characteristics of the LED filament. This layer modifies the radiation properties to enhance efficiency without requiring fundamental changes to the filament structure.

Inventive Principle:

Principle #32Color changes

Solution Approach 2:

The patent introduces a black body radiation layer as an intermediary between the LED chip and the external environment. This intermediate layer enhances radiation efficiency by optimizing the thermal-to-radiant energy conversion process.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If glass substrate is used for LED filament, then electrical insulation is provided, but thermal management is inadequate

Engineering Contradiction:

Improvethermal management efficiencyVSAvoidelectrical insulation reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent uses composite materials by combining metal substrate (for thermal management) with electrical insulation coatings or ceramic layers. This composite structure provides both efficient heat dissipation and reliable electrical insulation, overcoming the limitations of glass substrates.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies parameter changes by transitioning from glass substrate to metal substrate, fundamentally changing the thermal conductivity parameter while maintaining electrical insulation through surface coatings or ceramic layers.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly enhances heat dissipation and radiation efficiency by increasing thermal conductivity and radiation area, leading to improved performance and longevity of the LED light bulb.

Implementation Method 1

a thermal radiation film formed on a back face of the substrate... a black body radiation layer

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

filament supports featuring metal posts coated with graphene or borazon for enhanced thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10281129B1Filament structure of LED light bulb

Publication Date: 2019.05.07 BGT MATERIALS

AI summary

A light-emitting diode light bulb contains: a screw base, a transparent housing, at least one filament support, and at least one LED filament. The transparent housing includes an opening, and the screw base includes a positive terminal and a negative terminal. Each filament support includes two metal posts. Each LED filament includes a substrate, a first electrode pin, a second electrode pin, a thermal radiation film, at least one LED chip, a wire, and a fluorescent. The at least one LED chip is electrically connected with the first and second electrode pins, the first electrode pin is electrically connected with a first metal post, and the second electrode pin is electrically connected with a second metal post. The at least one LED filament and the at least one filament support are accommodated in the transparent housing, the screw base is housed into the opening, and the opening is closed.