LED Filament with Differential Hardness Carrier
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Solution Overview
Problem
Conventional LED bulb manufacturing faces challenges with manual alignment and welding of LED filaments, leading to potential component failure and high costs due to the need for external forces to bend copper frames, which can be costly and structurally weak.
Innovation Solution
The design of an LED filament with a carrier having distinct lateral sections of varying hardness, where a softer adhesive forms one section and a harder adhesive forms the other, allowing for customizable structural strength without increasing costs, and incorporating a substrate with through-holes for improved heat dissipation and light guidance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual alignment and welding of LED filaments is used in conventional LED bulb manufacturing, then the manufacturing process is simple, but component failure occurs easily due to copper frame bending and external forces are needed which increase costs
Solution Approach 1:
The carrier is segmented into multiple lateral sections (first lateral section, second lateral section, third lateral section) with different hardness values. This segmentation allows each section to serve different functions: the softer first lateral section absorbs stress and prevents bending, while the harder second and third lateral sections provide structural support and resistance to external forces, thereby improving reliability without complicating the manufacturing process
Solution Approach 2:
Different lateral sections of the carrier are assigned different local qualities (hardness values). The first lateral section has lower hardness (softer adhesive) to provide flexibility and stress absorption, while the second and third lateral sections have higher hardness (harder adhesive) to provide structural strength. This local differentiation resolves the contradiction by making the carrier both reliable and easy to manufacture
2Manufacturing precision
If external forces are applied to bend copper frames for alignment, then alignment can be achieved, but costs increase and structural weakness is introduced
Solution Approach 1:
The carrier is pre-formed with different hardness characteristics in different lateral sections before the actual assembly process. The softer first lateral section is designed in advance to naturally absorb alignment stresses, eliminating the need for external bending forces during manufacturing. This preliminary design of differential hardness achieves precise alignment without additional cost
Solution Approach 2:
The hardness parameter of the adhesive material is changed across different lateral sections of the carrier. By varying the Shore hardness type A of the adhesive from softer (first lateral section) to harder (second and third lateral sections), the carrier can achieve precise alignment through its inherent material properties rather than requiring external forcing, thus reducing manufacturing costs while maintaining alignment precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the LED filament to achieve high structural strength while reducing costs, ensuring reliable operation and efficient heat dissipation without sacrificing structural integrity.
Implementation Method 1
the carrier includes a substrate, a first adhesive and a second adhesive, the LED chips are disposed on the first surface of the substrate, the first lateral section is formed by the first adhesive covering the first surface and the LED chips
Implementation Method 2
the second lateral section is formed by the second adhesive covering the second surface
Implementation Method 3
The substrate is formed by a metal material, transparent ceramic, sapphire or glass
Data Source
AI summary
The present disclosure relates to a LED filament and a LED bulb with the LED filament. The LED filament includes a carrier, LED chips disposed on the carrier, the carrier includes a first lateral section and a second lateral section opposite to the first lateral section, the LED chips are formed on the first lateral section, hardness of the first lateral section is less than that of the second lateral section. The disclosure further provides a LED bulb with the LED filament above. The LED filament above has benefits of improving structural strength and decreasing costs.