LED Filament Lead Frame with Segmented Mounting Zones
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Solution Overview
Problem
Conventional LED filaments require a separate production line and are complex to produce, making them inefficient and difficult to achieve all-sided radiation effectively.
Innovation Solution
A device comprising a lead frame with external electrical connection parts, a moulded body that is electrically insulating and transmissive to radiation, and semiconductor chips arranged on the moulded body without overlapping with the lead frame, allowing for omnidirectional radiation and improved heat dissipation through the lead frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LED filaments are produced using conventional separate production lines, then production complexity increases, but manufacturing efficiency decreases
Solution Approach 1:
The patent combines the LED chip mounting substrate and the heat dissipation structure into a single integrated lead frame component. This merging eliminates the need for separate production lines for mounting substrates and heat sinks, allowing both functions to be manufactured together in one process, thereby reducing production complexity while maintaining or improving manufacturing efficiency
Solution Approach 2:
The lead frame is designed to serve multiple functions simultaneously: it acts as the mounting substrate for LED chips, provides heat dissipation pathways, and serves as the electrical connection structure. This multi-functionality eliminates the need for separate components and production processes for each function, resolving the contradiction between manufacturing simplicity and efficiency
2Stability of the object's composition
If LED chips are arranged on a substrate with overlapping lead frame, then structural integration improves, but radiation uniformity deteriorates
Solution Approach 1:
The lead frame is segmented into distinct functional zones: areas for mounting LED chips and separate areas for heat dissipation and electrical connection. This segmentation allows the LED chips to be arranged on the substrate without the lead frame material interfering with the radiation path, ensuring uniform omnidirectional radiation while maintaining structural integration through the unified lead frame design
3Temperature
If heat dissipation is improved through lead frame, then thermal management improves, but electrical conductivity requirements increase complexity
Solution Approach 1:
The lead frame is designed to simultaneously provide both heat dissipation pathways and electrical connection pathways using the same structural elements. The metallic lead frame material serves dual purposes: conducting heat away from the LED chips and conducting electrical current to and from the chips. This eliminates the need for separate thermal management and electrical connection systems, improving heat dissipation without increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and reliable production of LED filaments with omnidirectional radiation, similar to traditional filaments, and enhances heat dissipation, allowing for long-term stability and simplified production processes.
Implementation Method 1
the moulded body is expediently transmissive to the radiation generated during operation of the device
Implementation Method 2
improved heat dissipation through the lead frame
Implementation Method 3
semiconductor chips which are configured to generate radiation. For example, the semiconductor chips are formed as luminescent diode chips, in particular as light emitting diode chips
Data Source
AI summary
A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, whereinthe lead frame has two connection parts for external electrical contacting of the device;the moulded body is formed to the lead frame;the moulded body is transmissive to the radiation generated during operation of the device; andthe semiconductor chips are arranged on a front-side of the moulded body and each of the semiconductor chips overlap with the device with the moulded body in plan view of the device.Furthermore, a method for producing devices is specified.