LED Filament Structure for Uniform Light and Fracture Resistance

The patent applies local quality by creating a gradient structure in the filament where the cross-sectional area varies along its length. The filament is thicker at the ends and thinner in the middle, which strategically distributes stress away from the densely packed LED chip regions. This local variation in geometry allows high luminous efficiency in the chip arrangement while preventing stress concentration that would cause fractures.

The patent employs spheroidality by shaping the filament into a curved, three-dimensional structure rather than a straight line. This curved arrangement allows the LED chips to be positioned at various angles, directing light emission in multiple directions simultaneously. The filament is configured to wrap around or curve within the bulb, creating omnidirectional illumination while maintaining the energy efficiency of LED technology.

The patent replaces the environmentally problematic graphene coating with alternative heat dissipation structures that do not rely on persistent carbon-based materials. The design uses metallic substrates or ceramic coatings that are either recyclable or have lower environmental impact. The heat dissipation function is achieved through structural design (increased surface area, thermal pathways) rather than dependence on specific carbon nanomaterials, thereby eliminating the pollution issue while maintaining thermal management.

The patent merges the wiring function with the filament substrate itself. Instead of using separate metal wires that create stress concentration points, the LED chips are directly mounted onto the continuous filament structure. The filament serves both as the structural support and as the electrical conductor, eliminating discrete wiring joints that would be vulnerable to stress and breakage. This integration of structural and electrical functions removes the weak points in the system.