LED Filament Bulb with Stacked Fluorescent Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing LED technologies face challenges in replicating the aesthetic and nostalgic appeal of traditional filament light bulbs, particularly in terms of heat dissipation and appearance, when attempting to integrate LED technology into filament bulb applications.
Innovation Solution
The development of a lighting apparatus that incorporates multiple LED package modules with fluorescent layers and adjustable LED chip positions, along with a substrate and driver system, allowing for varied light emission characteristics and color temperatures by adjusting current ratios and fluorescent layer configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LED technology is applied to filament bulb applications, then luminous efficacy is improved, but heat dissipation and appearance become problematic
Solution Approach 1:
The invention divides the single LED light source into multiple LED chips (first LED chip, second LED chip, third LED chip) arranged in series. Each LED chip generates light that passes through specific fluorescent layers, segmenting the light generation process to achieve both energy efficiency and controlled heat distribution across multiple smaller components rather than one large heat-generating element.
Solution Approach 2:
Fluorescent layers serve as intermediaries between the LED chips and the final light output. The first fluorescent layer converts light from the first LED chip, the second fluorescent layer converts light from the second LED chip, and the third fluorescent layer converts light from the third LED chip. These intermediary fluorescent materials transform the light characteristics while managing thermal energy conversion.
2Adaptability or versatility
If multiple LED chips with different fluorescent layers are used, then light output customization is improved, but device complexity increases
Solution Approach 1:
The invention merges multiple LED chips and fluorescent layers into a single integrated light apparatus. The first LED chip, second LED chip, and third LED chip are combined in series connection, with their respective fluorescent layers (first, second, and third fluorescent layers) integrated into the same structural space, allowing multiple light generation functions in one unified device.
Solution Approach 2:
The invention arranges LED chips and fluorescent layers in a vertical stacked configuration rather than horizontal arrangement. The first LED chip is positioned above the second LED chip, which is positioned above the third LED chip, with fluorescent layers interspersed between them. This vertical stacking in the third dimension allows complex light output customization while maintaining a compact footprint.
3Adaptability or versatility
If LED chips are positioned at different heights with different fluorescent layers, then color temperature adjustment is improved, but manufacturing precision requirements increase
Solution Approach 1:
The invention assigns different fluorescent layers to different LED chips based on their vertical positions. The first fluorescent layer is positioned between the first and second LED chips, the second fluorescent layer is positioned between the second and third LED chips, and the third fluorescent layer is positioned below the third LED chip. Each fluorescent layer has specific optical properties tailored to convert light from its associated LED chip, creating local quality variations that enable color temperature adjustment.
Solution Approach 2:
The invention changes the optical parameters of the fluorescent layers to achieve different color temperatures. By selecting fluorescent materials with different emission characteristics for the first, second, and third fluorescent layers, the system can adjust the overall color temperature of the light output by varying which LED chips are active and how their light is transformed by the respective fluorescent layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables cost-effective integration of LED technology into filament bulb designs, offering improved heat dissipation, customizable light output, and adjustable color temperatures, effectively addressing the aesthetic and functional challenges of traditional bulbs.
Implementation Method 1
the LED chip emits a blue light
Implementation Method 2
a first fluorescent layer, and a second fluorescent layer. The first fluorescent layer is stacked below the second fluorescent layer. The light emitting area of the first chip is placed in the first fluorescent layer. A light emitting area of the second chip is placed in the second fluorescent.
Data Source
AI summary
A lighting apparatus includes multiple LED packages, a substrate and a driver. The LED package module includes a package housing, a LED chip and a second LED chip, a first fluorescent layer, and a second fluorescent layer. The first fluorescent layer is stacked below the second fluorescent layer. A light emitting area of the first chip is placed in the first fluorescent layer. A light emitting area of the second chip is placed in the second fluorescent.