LED Fixture Chip-on-Board Thermal Mounting
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Solution Overview
Problem
Conventional light fixtures using LEDs are inefficient due to the need for separate printed circuit boards, which increase production cycles, assembly time, and reduce thermal conductivity, leading to increased costs and decreased efficiency.
Innovation Solution
The implementation of chip-on-board technology allows LEDs to be directly mounted to the light fixture's reflector or a separate thermally conductive board, eliminating the need for intermediate materials and streamlining the manufacturing process by providing a direct heat dissipation path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a separate printed circuit board is used to mount LEDs, then the LEDs can be pre-assembled and inventoried, but the production cycle length increases and assembly time increases
Solution Approach 1:
The patent combines the LED mounting function directly into the light fixture housing by integrating a printed circuit board within the housing structure. This eliminates the need for separate PCB assembly and attachment steps, thereby reducing production cycle length while maintaining ease of manufacture.
2Ease of manufacture
If a separate printed circuit board is used to mount LEDs, then the LEDs can be pre-assembled, but the assembly time increases
Solution Approach 1:
By integrating the printed circuit board within the light fixture housing, the patent eliminates the separate step of attaching a pre-assembled PCB to the fixture. This merging of functions reduces assembly time and improves productivity while maintaining manufacturing ease through standardized housing integration.
3Temperature
If intermediate conductive materials are used between LEDs and housing, then thermal contact is improved, but the expense increases
Solution Approach 1:
The patent eliminates intermediate conductive materials by directly mounting the printed circuit board to the housing structure with thermal contact paths. This extraction of unnecessary intermediate components reduces material costs and expense while maintaining effective thermal contact through direct mounting arrangements.
4Temperature
If intermediate conductive materials are used between LEDs and housing, then thermal contact is achieved, but the efficiency decreases
Solution Approach 1:
By removing intermediate conductive materials and implementing direct mounting of the printed circuit board to the housing, the patent creates more efficient thermal pathways. This reduces thermal resistance and energy loss, improving overall system efficiency while maintaining adequate thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production time and costs, enhances thermal conductivity, and enables efficient LED mounting, making the light fixtures more efficient and cost-effective.
Implementation Method 1
An LED used for lighting or illumination converts electrical energy to light in a manner that results in very little radiant energy outside the visible spectrum
Implementation Method 2
there is decreased thermal contact between the LEDs and the housing of the light fixture
Data Source
AI summary
Light fixtures for illuminating spaces that use light emitting diode-based light sources and that incorporate chip on board technology that enables the light emitting diode to be mounted directly on a portion of the light fixture. In some embodiments, the light fixture includes a reflector assembly onto which the light emitting diode is directly mounted. In other embodiments, the reflector assembly includes an aperture that receives a board having chip on board technology onto which the light emitting diode is directly mounted. In some embodiments, the light fixture also includes a diffuser for diffusing the light emanating from the light emitting diodes.