LED Fixture Thermal Management via Segmented Mounting

Solution Overview

Problem

Conventional LED fixtures face inefficiencies in heat dissipation due to the use of a heat sink puck, which reduces thermal performance and can cause LED drivers to overheat, leading to reduced efficiency and potential failure.

Innovation Solution

An LED fixture design featuring a finless aluminum housing with a separate aluminum globe ring and a mounting plate that serves as a heat sink, eliminating the need for a heat sink puck and providing thermal separation between the LED array and drivers, allowing for uniform heat dissipation and improved thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a heat sink puck is used to mount both LED array and LED drivers, then the structure is simplified, but heat dissipation efficiency decreases and LED drivers overheat

Engineering Contradiction:

Improvestructural simplicityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The patent divides the mounting structure into separate components: the LED array is mounted on the heat sink puck while LED drivers are mounted on a separate mounting plate attached to the housing. This segmentation allows each component to have its own thermal management path, preventing heat from the LED array from transferring to the LED drivers, thus resolving the overheating issue while maintaining structural simplicity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a thermal barrier or insulation layer between the heat sink puck and the mounting plate where LED drivers are located. This intermediary element blocks heat transfer from the high-temperature LED array to the LED drivers, enabling both components to coexist in close proximity without thermal interference, thereby improving heat dissipation efficiency.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Illumination intensity

If multiple LEDs are incorporated into a single lamp to increase brightness, then illumination intensity improves, but heat generation increases

Engineering Contradiction:

Improvelighting brightnessVSAvoidheat generation

Core Design Contradiction:

Illumination intensityVSObject-generated harmful factors

Solution Approach 1:

The patent extracts the LED drivers from the heat sink puck and mounts them on a separate mounting plate. This extraction removes the heat-sensitive electronic components from the high-temperature environment created by multiple high-power LEDs, allowing the lamp to achieve high illumination intensity without excessive heat affecting the drivers' performance and reliability.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a thermal barrier or insulation layer between the heat sink puck and the mounting plate where LED drivers are located. This intermediary element blocks heat transfer from the high-temperature LED array to the LED drivers, enabling both components to coexist in close proximity without thermal interference, thereby improving heat dissipation efficiency.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If LED drivers are mounted on the back side of the heat sink puck, then space utilization improves, but Tc point increases causing driver shutdown

Engineering Contradiction:

Improvespace utilizationVSAvoiddriver performance

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent divides the mounting structure into separate components: the LED array is mounted on the heat sink puck while LED drivers are mounted on a separate mounting plate attached to the housing. This segmentation allows each component to have its own thermal management path, preventing heat from the LED array from transferring to the LED drivers, thus resolving the overheating issue while maintaining structural simplicity.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances thermal performance by ensuring efficient heat dissipation from the LED array without affecting the LED drivers, preventing overheating and improving the overall reliability and longevity of the LED fixture.

Implementation Method 1

heat generated by the LED array is dissipated through the base and sides of the aluminum housing

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the mounting plate serves as a heat sink providing thermal separation between the LED drivers and the LED array

Methodology Applied

Scientific EffectHeat sink: Heat Sink

Data Source

PatentUS10704778B2LED fixture

Publication Date: 2020.07.07 APPLETON GROUP LLC

AI summary

An LED fixture is provided including a housing having a hollow configuration, a mounting plate secured to an upper end of the housing, a globe ring, separate from the housing, secured to a lower exterior end of the housing, a base on the housing extending within the globe ring, and an LED array positioned on the base of the housing.