LED Fixture Heat Sink with Spaced Driver Housing
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Solution Overview
Problem
Conventional LED fixtures face inefficiencies in heat dissipation due to the absence of a thermal barrier between LEDs and drivers, leading to reduced performance and potential damage from excessive temperature, and non-uniform heat dissipation.
Innovation Solution
The LED fixture design includes a bowl-shaped heat sink with chamfered fins for improved heat dissipation, a spaced driver housing for separate thermal management, and a protective globe for easy maintenance, along with a drain hole and mounting extensions for enhanced functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If LEDs and drivers are mounted on the same heat sink puck, then device complexity is reduced, but heat dissipation efficiency decreases and thermal performance deteriorates
Solution Approach 1:
The invention divides the mounting structure into separate components: a base for mounting LEDs and a driver housing for mounting drivers. This segmentation allows independent thermal management for each component, preventing heat from LEDs from directly affecting drivers while maintaining separate heat dissipation pathways.
Solution Approach 2:
The invention introduces a thermal barrier between the LED array and drivers, which acts as an intermediary to block direct heat transfer. This thermal barrier allows the system to maintain electrical connectivity while preventing harmful thermal coupling between the heat-generating LEDs and the temperature-sensitive drivers.
2Illumination intensity
If multiple LEDs are incorporated into a single lamp to increase brightness, then illumination intensity improves, but heat generation increases and heat dissipation becomes less effective
Solution Approach 1:
The invention extends heat dissipation from a two-dimensional surface (heat sink puck) to a three-dimensional structure by adding vertically extending fins to the base. This dimensional expansion significantly increases the heat dissipation surface area, allowing the system to effectively manage heat from multiple high-power LEDs.
Solution Approach 2:
The base is designed with multiple fins that segment the heat dissipation function across multiple surfaces, allowing heat from different LED regions to be dissipated through different fin pathways, improving overall heat management efficiency.
3Device complexity
If no thermal barrier is provided between drivers and LEDs, then device complexity is reduced, but LED efficiency decreases and driver performance deteriorates
Solution Approach 1:
The thermal barrier serves as an intermediary element that selectively blocks heat transfer while allowing the system to maintain its electrical and functional integrity. This barrier is strategically positioned to protect sensitive components without interfering with the operational coupling between LEDs and drivers.
Solution Approach 2:
The thermal barrier is implemented locally at the interface between LED and driver mounting areas, providing targeted thermal protection only where needed. This localized approach maintains thermal isolation where required while preserving system functionality and minimizing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a 14% reduction in LED operating temperature, 17% reduction in driver temperature, and a 25% increase in light output, while facilitating easier installation and maintenance with improved thermal performance and heat dissipation.
Implementation Method 1
The heat sink has a hollow configuration... The base is configured at an operative bottom portion of the heat sink to support an array of LEDs
Implementation Method 2
The plurality of fins extends circumferentially from the heat sink... each of the fins has chamfered edges
Implementation Method 3
Globe—The term 'globe' hereinafter in the complete specification refers to a protective transparent cover provided for LEDs through which the light generated by the LEDs passes
Data Source
AI summary
An LED fixture (200) that facilitates effective heat dissipation of an array of LEDs, having improved thermal performance; and is easy to mount or dismount. The LED fixture (200) includes a heat sink (202) having a hollow configuration, and a plurality of fins (204) extending circumferentially and outwardly from the heat sink (202). The LED fixture (200) further comprises a base (206) configured at an operative bottom portion of the heat sink (202), and a driver housing (208) connected to an operative top surface of the heat sink (202). The base (206) is configured to support an array of LEDs. The driver housing (208) is configured to accommodate a plurality of LED drivers. The driver housing (208) and the base (206) are arranged in a spaced apart configuration.