LED Fixture Thermal Boss for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED light fixtures face challenges with heat dissipation due to a long thermal path between the LED junction and heatsink, and insufficient airflow, which limits their use in high-output applications where rapid heat dissipation is necessary.
Innovation Solution
The solution involves directly connecting the LED to the heatsink by removing the circuit board from the thermal path and creating air inlets between LEDs on an open heatsink to enhance convection, allowing heat to be conducted directly from the LED to the heatsink and then dissipated through convection and radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional LED fixture structure with circuit board is used, then the LED is electrically supported and connected, but the thermal path becomes long and heat dissipation efficiency deteriorates
Solution Approach 1:
The circuit board is segmented from the thermal path by creating a thermal boss that protrudes through the circuit board. This separates the electrical support function (circuit board) from the thermal conduction function (heatsink boss), allowing heat to bypass the circuit board while electrical connections remain intact.
Solution Approach 2:
A thermal boss acts as an intermediary element between the LED and the heatsink. This boss protrudes through the circuit board and provides a direct thermal conduction path, mediating between the electrical support structure and the thermal management system.
2Illumination intensity
If high-output LEDs are used to increase light output, then illumination intensity improves, but heat buildup increases and LED lifetime deteriorates
Solution Approach 1:
The circuit board is extracted from the thermal path between the LED and heatsink. By removing the circuit board material from this critical thermal pathway, heat can flow more directly from the LED junction to the heatsink, preventing temperature buildup that would otherwise shorten LED lifetime in high-output applications.
3Ease of manufacture
If the circuit board remains in the thermal path, then electrical support is maintained, but the thermal path length increases and heat transfer slows
Solution Approach 1:
The thermal boss extends in the vertical dimension through the circuit board, creating a three-dimensional thermal conduction path. This vertical protrusion allows heat to travel directly through the boss while the circuit board maintains its horizontal electrical support structure, effectively adding a thermal dimension without compromising electrical functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the LED junction temperature, enabling the use of LED light fixtures in high-output applications by improving heat dissipation efficiency and preventing overheating.
Implementation Method 1
Heat transfer takes the forms of conduction, convection, and radiation. Conduction is the movement of heat through matter without motion of the matter—ignoring the small-scale motion that occurs on a molecular level. Conduction is the movement of heat from a warmer area to a cooler area.
Implementation Method 2
Convection is heat transfer created by a flowing fluid, where warmer fluid is less dense and rises, drawing in fluid behind itself.
Implementation Method 3
LEDs, or light emitting diodes, are eroding the market for conventional light bulbs. The reason for switching to LEDs is efficiency. LEDs convert electrical energy to light with less wasted power as compared to older technologies
Data Source
AI summary
The LED construction of the invention simplifies the thermal path for heat by directly connecting the LED and the heatsink, removing the circuit board from the thermal path. This is accomplished by a heatsink boss that protrudes from the heat sink, through an opening in the circuit board, and contacting the LED.