LED Light Fixture Inter-LED Flow-Through Cooling Heatsink

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Solution Overview

Problem

Conventional LED light fixtures struggle with heat dissipation, particularly in high-output applications, due to a long thermal path and insufficient airflow, which leads to overheating and reduced LED lifespan.

Innovation Solution

The LED Light Fixture with Inter-LED Flow-Through Cooling design places LEDs apart on an open heatsink with air inlets between them, allowing direct heat conduction to the heatsink and enhanced convection through the fins, eliminating the circuit board from the thermal path and increasing airflow across the heatsink.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If conventional LED fixtures are used with high-output LEDs, then light output increases, but heat dissipation becomes insufficient leading to overheating

Engineering Contradiction:
Improvelight outputVSAvoidLED junction temperature
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The heatsink is designed with multiple separate cooling channels, each dedicated to cooling individual LEDs. This segmentation allows each LED's heat to be independently managed and dissipated through its own airflow path, preventing heat accumulation even when multiple high-output LEDs are operating simultaneously.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces vertical airflow through the heatsink structure, creating a third dimension for heat dissipation. Air enters through bottom inlet ports and exits through top outlet ports, flowing upward through the heatsink fins to extract heat from LEDs arranged in vertical stacks, significantly increasing the heat transfer surface area and efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Illumination intensity

If multiple high-output LEDs are used to increase light output, then illumination intensity improves, but the thermal path becomes longer and heat dissipation efficiency decreases

Engineering Contradiction:
Improvelight outputVSAvoidthermal path length
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent extracts the circuit board from the thermal path between the LEDs and heatsink. By using individual LED mounts that attach directly to the heatsink without requiring the circuit board as a thermal interface, the thermal path is shortened and simplified, reducing thermal resistance and improving heat transfer efficiency.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The heatsink serves multiple functions simultaneously: it provides mechanical support for the LEDs, acts as a thermal management system with integrated cooling channels, and serves as the mounting structure eliminating the need for separate circuit boards in the thermal path.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Device complexity

If conventional heatsink designs are used, then device simplicity is maintained, but airflow across the heatsink is insufficient for effective cooling

Engineering Contradiction:
Improveheatsink structureVSAvoidheat dissipation rate
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent applies pneumatic principles by designing the heatsink with integrated airflow channels that guide air movement through the structure. Bottom inlet ports draw air in, which then flows upward through vertical channels between the fins, maximizing convective heat transfer from the LED-studded fin surfaces to the moving air.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Solution Approach 2:

The heatsink employs a finned structure that creates a porous-like thermal field, where air can flow through multiple pathways between closely spaced fins. This increases the effective surface area for heat transfer while maintaining reasonable airflow resistance, enabling efficient cooling of multiple LEDs simultaneously.

Inventive Principle:
Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces LED junction temperature by improving heat transfer through conduction and convection, enabling the use of LEDs in high-output applications where conventional fixtures would overheat.

Implementation Method 1

direct heat conduction to the heatsink

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

enhanced convection through the fins

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS10295168B1LED light fixture with inter-LED flow-through cooling
Publication Date: 2019.05.21 ALUMINIS LLC
  • US10295168B1 patent drawing
  • US10295168B1 patent drawing
  • US10295168B1 patent drawing

AI summary

The LED Light Fixture with Inter-LED Flow-Through Cooling dissipates heat by placing two or more LEDs against a heatsink, spacing the LEDs apart from each other. The spaces between the LEDs are open to the heatsink below, creating air inlets into the heatsink. Air flows into the air inlets, passes by the fins of the heatsink, and exits through the top, bottom, or sides of the heatsink, depending on the orientation of the device. The result is airflow through the fixture, cooling the heatsink and the LEDs.