LED Light Emitting Element With Fluid Circulation Heat Dissipation
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Solution Overview
Problem
Conventional heat dissipation methods for LEDs are ineffective due to the high cost of materials with good heat dissipation properties, leading to elevated junction temperatures and reduced service life.
Innovation Solution
A light emitting element design featuring a printed circuit board with a chip, a first encapsulation body covering the chip, and a second encapsulation body covering the printed circuit board, with pipes and fluid encapsulated within, allowing heat to circulate and dissipate effectively, reducing junction temperature and prolonging service life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods are used, then the structure is simple, but the heat dissipation effect is poor and junction temperature is high
Solution Approach 1:
The encapsulation body is divided into multiple chambers (first encapsulation chamber, second encapsulation chamber, third encapsulation chamber) separated by partitions, with each chamber containing fluid for heat dissipation. This segmentation allows efficient heat dissipation through distributed fluid circulation while maintaining a manageable structural complexity
Solution Approach 2:
Fluid is introduced as an intermediary substance to transfer heat from the chip to the encapsulation body walls and ultimately to the external environment. The fluid circulates through the enclosed chambers, absorbing heat from the chip region and carrying it away, thereby solving the heat dissipation problem without requiring complex external cooling systems
2Temperature
If materials with good heat dissipation properties are used, then the heat dissipation effect is improved, but the cost is high
Solution Approach 1:
The invention uses fluid circulation (hydraulic principle) within enclosed chambers to achieve heat dissipation. Instead of relying on expensive solid materials with high thermal conductivity, the system uses fluid flow to transport heat away from the chip, providing effective heat dissipation through a cost-effective hydraulic approach
Solution Approach 2:
The invention changes the heat dissipation approach from relying on material thermal conductivity parameters to utilizing fluid flow dynamics parameters. By controlling fluid circulation within the encapsulation chambers, the system achieves heat dissipation effectiveness without requiring expensive high-conductivity materials
3Duration of action of stationary object
If the junction temperature is high, then the heat dissipation problem is not solved, but the service life is reduced
Solution Approach 1:
The encapsulation body is pre-designed with integrated fluid circulation chambers and heat dissipation pathways before the LED chip is operated. This preliminary structural arrangement ensures that heat dissipation capability is built-in from the start, preventing junction temperature rise before it can affect service life
Solution Approach 2:
The invention converts the harmful heat generated by the chip into a beneficial driving force for fluid circulation. The heat creates temperature differences that drive natural convection or forced circulation of the fluid, transforming the harmful thermal energy into a useful cooling mechanism that extends service life
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation, decreases junction temperature, and significantly prolongs the service life of the light emitting element, improving the performance and stability of associated devices like backlight modules and liquid crystal display devices.
Implementation Method 1
the fluid is heated to circulate within the first encapsulation body, the first pipe, the second encapsulation body and the second pipe
Implementation Method 2
the fluid is heated to circulate within the first encapsulation body, the first pipe, the second encapsulation body and the second pipe
Data Source
AI summary
A light emitting element comprises: a printed circuit board, a chip disposed on a first face of the printed circuit board, a first encapsulation body and a second encapsulation body. The first encapsulation body covers the chip, and the second encapsulation body covers a second face of the printed circuit board or a part of the second face of the printed circuit board. A first pipe and a second pipe are extended respectively from two positions of the first encapsulation body and are respectively connected to two positions of the second encapsulation body. Fluid is encapsulated within the first encapsulation body, the first pipe, the second encapsulation body and the second pipe.