LED Frame Structure with Metallic Heat Dissipation
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Solution Overview
Problem
Existing frame structures for surface mount device (SMD) LEDs used as side light sources face issues with light leakage and inadequate heat dissipation, leading to reduced life expectancy due to high temperatures.
Innovation Solution
A frame structure comprising metallic frames with extension portions and a plastic housing, where the metallic frames have different electrical polarities and are positioned to form a receiving space, allowing for efficient heat dissipation without light leakage, using non-transparent metal to prevent light penetration and enhance heat conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the plastic housing is made smaller to reduce device size, then the device becomes more compact, but light leakage occurs and heat dissipation becomes inadequate
Solution Approach 1:
The housing is segmented into two distinct materials: plastic housing for light emission and metal housing for heat dissipation. This segmentation allows each material to perform its optimal function without compromising the other, resolving the contradiction between compact size and heat management.
Solution Approach 2:
Different regions of the housing have different material properties: the plastic portion is transparent for light emission while the metal portion is opaque and thermally conductive for heat dissipation. This local differentiation of material quality enables the device to maintain compact size while preventing light leakage and managing heat effectively.
2Length of stationary object
If the plastic housing is made thinner to reduce device thickness, then the device becomes slimmer, but light leakage increases and heat dissipation efficiency decreases
Solution Approach 1:
The housing thickness is segmented into functional zones: thin plastic section for light transmission and a separate metal section for heat dissipation. This allows the overall housing to be thin while maintaining effective heat management and preventing light leakage through the metal portion.
Solution Approach 2:
The housing exhibits local quality variation where the plastic region is thin and transparent for light emission, while the metal region provides thermal management. This localized differentiation enables the device to be slim overall while preventing harmful effects at critical locations.
3Temperature
If metal frames are used to improve heat dissipation, then heat dissipation efficiency increases, but light leakage may occur if metal blocks light
Solution Approach 1:
The housing is segmented into distinct functional regions: plastic material is used where light transmission is required, while metal material is used where heat dissipation is prioritized. This spatial segmentation resolves the contradiction by assigning each material to its optimal functional zone.
Solution Approach 2:
The housing exhibits local quality differentiation with transparent plastic in light-emission zones and opaque metal in heat-dissipation zones. This allows the structure to simultaneously achieve good light transmission where needed and effective heat dissipation where required, without mutual interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents light leakage and improves heat dissipation, extending the life expectancy of the LED by directing light emissions and managing heat efficiently, ensuring the LED remains compact and slim while maintaining performance.
Implementation Method 1
Because the metal is not transparent and its efficiency of heat dissipation is high, the frame structure has a good efficiency of heat dissipation without light leakage
Implementation Method 2
Light emitting diode (LED) is a semiconductor device that emits light when electrically biased in the forward direction
Data Source
AI summary
A frame structure includes a first metallic frame, a second metallic frame, and a plastic housing. The first metallic frame has extension portions extending outwardly, and the first metallic frame is separately positioned from the second metallic frame. The first metallic frame and the second metallic frame respectively have different electrical polarities. The plastic housing is connected with the first metallic frame and the second metallic frame, and the plastic housing and the two extension portions form a receiving space so the two extension portions are positioned at two ends of the plastic housing. The plastic housing receives the LED die and a packaging layer. The extension portions expose out of the plastic housing or are nestled within the plastic housing.