LED Sealing Structure With Frame Body to Prevent Resin Cracking
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Solution Overview
Problem
The existing semiconductor light-emitting apparatus faces challenges in improving light extraction efficiency and reliability due to the distortion and cracking of the sealing resin caused by material differences between the sealing member and the package substrate, particularly when forming a dome-shaped sealing member.
Innovation Solution
A semiconductor light-emitting apparatus is designed with a frame body around the semiconductor light-emitting element, where the distance from the corner portions of the element to the frame body is smaller than the frame's width, reducing the amount of sealing member needed and thus minimizing stress, and a sealing member that covers both the element and the frame body, enhancing the sealing quality and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the thickness of the sealing member is increased to form a dome shape for improving light extraction efficiency, then the light extraction efficiency is improved, but the sealing member is easily exfoliated or cracked due to distortion caused by material difference
Solution Approach 1:
The frame body acts as an intermediary structure between the semiconductor light-emitting element and the sealing member. By providing this intermediate support structure, the sealing member can be positioned and supported without requiring excessive thickness, thus maintaining light extraction efficiency while preventing distortion and cracking that would occur with thicker sealing members alone.
Solution Approach 2:
The invention changes the geometric parameters of the sealing member by defining specific distance relationships between the corner portions of the semiconductor light-emitting element and the frame body. This parameter optimization allows the sealing member to have sufficient thickness for light extraction while being supported by the frame body to prevent excessive distortion and maintain reliability.
2Reliability
If the amount of sealing member is increased to cover the frame body and semiconductor light-emitting element, then the sealing quality is improved, but the distortion and stress on the sealing member increase
Solution Approach 1:
The sealing structure is segmented into two functional parts: the frame body that provides structural support and positioning, and the sealing member that provides sealing and light extraction functions. This segmentation allows the sealing member to be thinner and less stressed while still achieving adequate sealing quality through the combined structure.
Solution Approach 2:
The frame body serves as a mediator that distributes and reduces the stress on the sealing member. By positioning the frame body at specific distances from the corner portions of the semiconductor light-emitting element, the structure reduces the amount of sealing member material needed while maintaining sealing quality and reducing stress concentration.
Data Source
AI summary
A semiconductor light-emitting apparatus includes: a package substrate; a semiconductor light-emitting element flip-chip bonded on the package substrate; a frame body provided around the semiconductor light-emitting element on the package substrate; and a sealing member that covers an upper surface of the semiconductor light-emitting element on the package substrate, covers an upper surface of the frame body, and has translucency at an emission wavelength of the semiconductor light-emitting element. The upper surface of the semiconductor light-emitting element has a plurality of corner portions, and a distance from each of the plurality of corner portions to the frame body is smaller than a width of the upper surface of the frame body.