LED Frame Step Portion for Positioning Stability and Heat Dissipation
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Solution Overview
Problem
The existing light emitting diodes (LEDs) suffer from poor positioning between the frame and casing, leading to separation and inadequate heat dissipation, causing overheating and potential failure.
Innovation Solution
The design includes a casing with a placement area for the light emitting chip and a separate electrode area, featuring a step portion and protruding portions to enhance contact stability and heat absorption, with the placement area thicker than the electrode area and an opening for heat dissipation through metallic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a straight and flush structure is used for the frame, then the manufacturing process is simple, but the positioning effect between the plastic casing and the frame is poor
Solution Approach 1:
The invention introduces a step portion that creates a multi-level structure on the frame surface, transforming the flat two-dimensional contact interface into a three-dimensional structure with enhanced contact area. This dimensional change allows the plastic casing to engage with both the upper and lower surfaces of the step portion, significantly improving positioning stability while maintaining manufacturing simplicity
Solution Approach 2:
The frame surface is segmented into different levels through the step portion, creating distinct contact zones. The upper surface provides primary contact while the lower surface provides additional anchoring, dividing the contact function into multiple segments that work together to enhance positioning precision
2Device complexity
If the frame and plastic casing have limited contact area, then the structure is simple, but the stability of relative positioning between the casing and frame deteriorates
Solution Approach 1:
By introducing the step portion with its upper and lower surfaces, the contact interface is extended into the vertical dimension. This creates multiple contact planes that increase the overall contact area between the frame and plastic casing, thereby enhancing positioning stability without requiring additional components or complex assembly procedures
3Device complexity
If heat dissipation structures are not incorporated, then the device complexity is low, but the temperature of the LED keeps rising causing failure
Solution Approach 1:
The step portion serves multiple functions: it provides mechanical positioning stability by increasing contact area between the frame and plastic casing, and simultaneously functions as a heat dissipation structure. The metallic frame with its step portion conducts heat away from the LED, eliminating the need for separate heat dissipation components
Solution Approach 2:
The positioning structure and heat dissipation function are merged into a single integrated component - the frame with the step portion. This consolidation allows the same structural feature to address both mechanical stability and thermal management requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the stability of the casing-frame positioning and effectively dissipates heat, preventing overheating and extending the LED's operational lifespan.
Implementation Method 1
the placement area absorbs the heat generated by the light emitting chip during its operation. The heat absorption and dissipation effects executed by the metallic material will dissipate the heat through the opening
Implementation Method 2
the heat absorption and dissipation effects executed by the metallic material will dissipate the heat
Data Source
AI summary
A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided 5 with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.