LED Frame Structure for Uniform Fluorescent Distribution
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Solution Overview
Problem
Existing light emitting diodes (LEDs) face issues with non-uniform color reproducibility and reduced luminous efficiency due to uneven distribution of fluorescent substances during the curing process, leading to variations in color when viewed from different angles and increased production costs from additional processes.
Innovation Solution
A light emitting diode with a frame structure that maintains a uniform distance between the fluorescent substance and the LED chip, using a method involving a frame with a predetermined shape and size corresponding to the LED chip, where a mixture of fluorescent substance and encapsulant is applied and cured to form a molding portion matching the shape of the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the fluorescent substance is mixed in the liquid epoxy resin for the molding portion, then the fluorescent substance can be applied to encapsulate the LED chip, but the fluorescent substance precipitates during curing causing non-uniform distribution
Solution Approach 1:
A frame structure is introduced as an intermediary component between the LED chip and the molding portion. The frame provides a physical support structure that maintains uniform spacing, preventing fluorescent substance precipitation and ensuring even distribution throughout the encapsulant.
Solution Approach 2:
The invention changes the structural parameter by introducing a frame with specific height and geometry that corresponds to the LED chip dimensions. This parameter change establishes fixed spacing relationships that prevent material settlement during curing.
2Reliability
If a mixture of fluorescent substance and resin is dotted to encapsulate the LED chip, then encapsulation is achieved, but the mixture flows laterally causing color non-uniformity
Solution Approach 1:
The frame structure creates locally defined regions with controlled geometry. By matching the frame shape to the LED chip shape, the invention ensures that the encapsulant is confined to specific areas, preventing lateral flow and maintaining uniform color distribution in each localized region.
3Stability of the object's composition
If the fluorescent substance is contained in greater amount to compensate for precipitation, then color uniformity may be improved, but light emitting efficiency degrades
Solution Approach 1:
The frame structure performs a preliminary action by establishing fixed spacing and preventing precipitation before the curing process completes. This preliminary structural support ensures uniform distribution from the outset, eliminating the need to over-compensate with excess fluorescent material and preserving light emitting efficiency.
4Manufacturing precision
If additional processes are added to improve fluorescent substance distribution, then manufacturing precision may improve, but device complexity and production cost increase
Solution Approach 1:
The frame structure merges multiple functions into a single component: it provides structural support, defines the encapsulant boundary, maintains uniform spacing, and prevents material flow. This consolidation achieves high manufacturing precision without adding separate process steps or components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures uniform color expression and enhanced luminous efficiency by maintaining consistent distance and distribution of the fluorescent substance, reducing color variations and improving light emission consistency.
Implementation Method 1
a fluorescent substance 50 for absorbing light emitted from the light emitting diode chip 20 and performing wavelength conversion of the light into respective different wavelengths
Implementation Method 2
filling a liquid epoxy resin or the like into the reflecting portion 40 and thermally curing the resin for a predetermined time
Data Source
AI summary
The present invention relates to a light emitting diode and a method of fabricating the same, wherein the distance between a fluorescent substance and a light emitting diode chip is uniformly maintained to enhance luminous efficiency. To this end, there is provided a light emitting diode comprising at least one light emitting diode chip, lead terminals for use in applying electric power to the light emitting diode chip, and a frame that is used for mounting the light emitting diode chip thereon and is formed to have a predetermined height and a shape corresponding to that of the light emitting diode chip.