LED Module Front-Side Heat Spreading Structure
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Solution Overview
Problem
Conventional LED module designs that rely solely on backside heat sinks for heat dissipation are inefficient, as they occupy space on the circuit board and may not provide sufficient heat dissipation for all applications, limiting the effectiveness of thermal management.
Innovation Solution
Implementing a front-side heat spreading structure that includes a thermal pad on the circuit board's front side, where LEDs are mounted, and a heat spreading device in thermal contact with the pad, allowing for enhanced heat dissipation by creating multiple thermal paths from the LEDs to both the front and back sides of the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If only a backside heat sink is used, then the structure is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent transitions from single-sided (backside only) heat dissipation to dual-sided (frontside and backside) heat dissipation, adding a dimensional aspect to thermal management. The frontside heat spreading structure enables heat to be dissipated in multiple directions simultaneously, effectively doubling the heat dissipation pathways and improving thermal efficiency without proportionally increasing structural complexity.
2Loss of energy
If heat is removed only through the back side, then the circuit board structure is simple, but heat dissipation capacity is limited
Solution Approach 1:
The thermal management system is segmented into multiple independent heat dissipation pathways: a frontside heat spreading structure and a backside heat sink. Each pathway operates independently to conduct heat away from the LEDs, allowing the system to achieve higher total heat dissipation capacity by combining multiple segmented thermal paths rather than relying on a single centralized thermal management structure.
3Loss of energy
If thermal vias or thermal pads with intermediate layers are used, then heat can be transferred from front to back, but space on and within the circuit board is consumed
Solution Approach 1:
The patent extracts the heat spreading function from the internal structure (thermal vias and intermediate layers within the circuit board) and places it on the frontside surface as a dedicated heat spreading structure. This extraction eliminates the need for space-consuming internal thermal pathways while maintaining effective heat transfer, as the heat spreading occurs directly at the LED mounting surface without requiring penetration through the circuit board thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation efficiency by shortening the thermal path and potentially doubling the thermal spreading capabilities, enhancing reliability in applications requiring effective heat management, such as high-power LED lighting fixtures.
Implementation Method 1
a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad
Implementation Method 2
a heat sink coupled to the back side of the circuit board
Implementation Method 3
a heat sink coupled to the back side of the circuit board
Data Source
AI summary
A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.