Light-Emitting Device Glass Sealing Mold Release Film

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Solution Overview

Problem

The existing method of manufacturing light-emitting devices using low-melting-point glass often results in the glass adhering to the mold during the hot pressing process, making it difficult to separate the wiring board and light-emitting elements as finished products, and requiring additional work to remove the glass from the mold.

Innovation Solution

A method involving a metal thin plate sandwiched between the glass and the substrate, allowing the upper mold to press the glass via the thin plate, preventing direct contact and enabling easy separation of the mold from the glass after hot pressing, with the thin plate being removable after cooling and the glass being hardened.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If low-melting-point glass is directly contacted with the upper mold during hot pressing, then the glass can be effectively pressed and sealed, but the glass adheres to the mold and cannot be easily separated

Engineering Contradiction:
Improvesealing qualityVSAvoidmold separation
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

A release film is introduced as an intermediary layer between the glass and the upper mold. The release film prevents direct contact between the glass and mold surfaces, allowing the glass to be pressed and sealed effectively while enabling easy separation after hot pressing. The film is removed after the process, leaving the glass properly sealed without adhesion to the mold.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If glass is softened by heating for sealing, then the glass becomes pliable for bonding, but it adheres to the mold surface

Engineering Contradiction:
Improvebonding strengthVSAvoidadhesion to mold
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The release film serves as a mediator that allows the softened glass to bond to the substrate while preventing adhesion to the mold. The film is positioned between the glass and mold, enabling the glass to achieve proper bonding strength without sticking to the mold surface during the hot pressing process.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The release film creates a non-stick environment between the glass and mold, similar to how inert atmospheres prevent unwanted chemical reactions. The film's surface properties prevent adhesion, allowing the glass to be processed in a controlled environment that eliminates harmful adhesion to the mold.

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

3Productivity

If the glass is directly pressed by the mold, then the sealing pressure is effectively applied, but additional work is required to remove glass from the mold

Engineering Contradiction:
Improvesealing efficiencyVSAvoidglass removal time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The release film enables effective sealing pressure application while eliminating the need for additional glass removal work. After hot pressing, the film allows the glass to be easily separated from the mold without requiring manual removal or creating waste, thereby reducing time loss and improving overall productivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for successful separation of the glass-sealed light-emitting devices from the mold without glass adherence, facilitating efficient production by enabling direct removal and reuse of the substrate and glass, and ensuring the thin plate's flexibility aids in removing it without damaging the glass.

Implementation Method 1

low-melting-point glass softened by heating is stacked on the mounting surface of the wiring board

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

the hot pressing is performed using upper and lower molds temperature, of which is adjusted by a heater to fusion-bond the low-melting-point glass to the mounting surface of the wiring board

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 3

The metal thin plate has such a flexibility that it is deformed by an external force less than the cooled plate-shaped glass

Methodology Applied
Scientific EffectDeformation: Deformation

Data Source

PatentUS8367437B2Method of manufacturing light-emitting device
Publication Date: 2013.02.05 TOYODA GOSEI CO LTD
  • US8367437B2 patent drawing
  • US8367437B2 patent drawing
  • US8367437B2 patent drawing

AI summary

A method of manufacturing a light-emitting device includes arranging a plate-shaped glass on a light-emitting element mounting surface of a substrate having a light-emitting element mounted thereon, arranging a metal thin plate on the plate-shaped glass so as to sandwich the plate-shaped glass between the substrate and the metal thin plate, placing the substrate, the plate-shaped glass and the metal thin plate between a first mold on a side of the substrate and a second mold on a side of the metal thin plate, hot-pressing the substrate, the plate-shaped glass and the metal thin plate by using the first mold and the second mold to seal the light-emitting element with the plate-shaped glass, and after cooling the plate-shaped glass, removing the thin plate adhered to the plate-shaped glass from the plate-shaped glass.