LED Housing with Glass Sealing for Thermal Stability
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Solution Overview
Problem
High Power LEDs face reduced service life due to outgassing and yellowing of organic materials in resin encapsulants, and lack of hermetic encapsulation, leading to environmental degradation and thermal stability issues.
Innovation Solution
A housing comprising a composite of a base part and a head part, with a glass layer between them, where the base part serves as a heat sink and the head part provides a passage area for radiation, using metal materials with high thermal stability and hermetic sealing through glass bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resin or plastic structures are used to encapsulate high-power LEDs, then the housing is economical to produce, but the service life is reduced due to outgassing and yellowing of organic materials
Solution Approach 1:
The patent employs a composite structure consisting of a metal base part, a glass layer, and a metal head part. This composite material approach replaces the single-material resin encapsulation with a multi-material construction that combines the advantages of each material: metal provides thermal conductivity and structural stability, while glass provides hermetic sealing and resistance to outgassing and yellowing, thereby extending service life without sacrificing manufacturability
Solution Approach 2:
The patent changes the material parameters from organic resin to inorganic glass and metal. Specifically, the glass layer is positioned between the base part and head part to provide hermetic encapsulation, preventing environmental degradation and outgassing issues that plague organic materials, thus improving service life while maintaining production efficiency
2Ease of manufacture
If resin structures are used for high-power LEDs, then the housing is easy to manufacture, but thermal stability is insufficient for high-output devices
Solution Approach 1:
The composite structure uses metal base part and head part with high thermal conductivity combined with glass layer. The metal materials provide excellent thermal stability and heat dissipation capabilities necessary for high-output devices, while the glass layer maintains structural integrity at elevated temperatures, resolving the thermal stability limitation of resin structures
Solution Approach 2:
The patent extracts the organic resin material from the encapsulation structure and replaces it with inorganic materials (glass and metal). This extraction removes the thermal stability limitations inherent in organic materials while retaining the encapsulation function, enabling the housing to withstand the thermal demands of high-power LEDs
3Device complexity
If resin encapsulation is used, then the housing structure is simple, but hermetic encapsulation is not achieved, leading to environmental degradation
Solution Approach 1:
The glass layer in the composite structure provides hermetic encapsulation between the metal base part and head part. Glass inherently offers superior sealing properties compared to resin, creating a hermetic barrier that prevents environmental influences from degrading the LED and surrounding materials, thereby improving reliability without significantly increasing structural complexity
Solution Approach 2:
The patent applies different materials with specific local qualities to different regions of the housing: the glass layer is positioned specifically where hermetic sealing is most critical (between base part and head part), while metal materials provide thermal management and structural support. This localized material assignment optimizes hermetic sealing where needed most
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved thermal stability, hermetic encapsulation, and extended service life for high-power LEDs by using metal and glass components, enhancing heat removal and resistance to environmental influences.
Implementation Method 1
heating the first glass layer until the glass reaches a viscosity at which the glass adheres and the base part and the head part form a composite at least by means of the first glass layer
Implementation Method 2
the base part is a heat sink for the optoelectronic functional element
Implementation Method 3
the top of the base part is pre-oxidized and/or the bottom of the head part is pre-oxidized
Data Source
AI summary
A housing for radiation-emitting or radiation-receiving optoelectronic components such as LEDs and a method for producing the housing are provided. The housing has a base part and a head part that are joined by a glass layer. The top face of the base part defines an assembly region for an optoelectronic functional element and is also a heat sink for the optoelectronic functional element. The head part extends at least in sections over the peripheral extent of the assembly region, and above the assembly region it forms a passage area for the radiation emitted from or to be received by the optoelectronic functional element.