LED Die Bonding with Removable Gold Joins for Defect Rework
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Solution Overview
Problem
Existing light-emitting device manufacturing methods are inefficient in removing defective semiconductor elements mounted on wiring substrates, leading to production delays and reduced quality.
Innovation Solution
A method involving gold-containing joining portions and wiring portions on a substrate, where an adhesive member is used to evaluate and remove defective light-emitting elements by applying a temporary joining condition, followed by electrical evaluation and replacement with non-defective elements, utilizing specific temperature and load ranges for joining and removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional manufacturing methods are used to mount semiconductor elements on wiring substrates, then the light-emitting device can be produced, but defective elements cannot be efficiently removed and replaced
Solution Approach 1:
The patent divides the joining process into two distinct stages: a first joining condition that creates an initially joined state, and a second joining condition that creates a finally joined state. This segmentation allows defective elements to be easily removed during evaluation while maintaining the ability to firmly secure non-defective elements later, thereby improving defective element removal efficiency without sacrificing production time.
Solution Approach 2:
The patent performs a preliminary joining operation under the first joining condition before final evaluation and replacement. This preliminary action creates a temporarily joined state that allows for easy removal and electrical characteristic evaluation, enabling defective elements to be identified and replaced before the final joining process, thus improving overall productivity.
2Strength
If strong joining conditions are applied to secure semiconductor elements, then mechanical strength is improved, but defective elements cannot be easily removed for replacement
Solution Approach 1:
The patent employs dynamic joining conditions that change over time and based on evaluation results. The first joining condition applies lower temperature and/or pressure to create a removable initial bond, while the second joining condition applies higher temperature and/or pressure to create a strong permanent bond. This dynamic approach allows the joining strength to be adjusted according to the element's status (defective or non-defective), achieving both easy removal of defective elements and strong fixation of good elements.
Solution Approach 2:
The patent changes the parameters of the joining process by applying different temperature ranges and/or pressure levels in two distinct stages. The first joining condition uses parameters that allow easy removal (lower temperature and/or pressure), while the second joining condition uses parameters that ensure strong bonding (higher temperature and/or pressure). This parameter change strategy resolves the contradiction between strong joining and easy removal.
3Ease of repair
If multiple joining conditions are applied to enable defective element removal, then ease of repair is improved, but device complexity increases
Solution Approach 1:
The patent extracts the evaluation and replacement process from the conventional single-step joining process. By separating the joining operation into two distinct conditions with clear sequential steps, the system enables selective removal and replacement of defective elements while maintaining overall process manageability. This extraction of the repair function into a structured two-stage process improves ease of repair without excessively increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient removal and replacement of defective light-emitting elements, ensuring high-quality production by maintaining the mechanical and electrical integrity of the remaining elements.
Implementation Method 1
bringing an adhesive member into contact with the at least one first light-emitting element
Implementation Method 2
joining the first joining portion and first wiring portion of the plurality of wiring portions under a first joining condition by bringing the first joining portion and the first wiring portion into contact with each other
Data Source
AI summary
A method for manufacturing a light-emitting device includes: providing a plurality of first light-emitting elements, each comprising a joining portion containing gold; providing a support member including: a substrate, and a plurality of wiring portions, each disposed on the substrate and containing gold; joining the joining portions of the first light-emitting elements and corresponding wiring portions of the plurality of wiring portions under a first joining condition; evaluating whether at least one first light-emitting element of the plurality of first light-emitting elements is removable from the support member; evaluating electrical characteristics of each of the plurality of first light-emitting elements; and if the at least one first light-emitting element is removed from the support member, removing from the support member a first light-emitting element determined to be defective in the step of evaluating electrical characteristics of each of the plurality of first light-emitting elements.