Semiconductor Light-Emitting Substrate Groove Layout for Mounting Strength
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Solution Overview
Problem
Semiconductor light-emitting devices used as side-view type light sources face challenges in maintaining mounting strength due to reduced dimensions of concave grooves, leading to insufficient bonding with mounting substrates.
Innovation Solution
The semiconductor light-emitting device features a substrate with strategically designed concave grooves and wiring configurations, where the distance between certain edges of the grooves is optimized to enhance bonding with the mounting substrate, increasing mounting strength while reducing device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the dimensions of concave grooves are reduced to decrease device size, then the product size is reduced, but the bonding area with mounting substrate becomes insufficient and mounting strength decreases
Solution Approach 1:
The patent applies asymmetry by making the first distance between the first edge and third edge larger than the second distance between the second edge and fourth edge. This asymmetric design allows the concave groove to provide sufficient bonding area in the critical direction (first direction) while maintaining compact overall dimensions, thereby resolving the contradiction between device size reduction and mounting strength maintenance
Solution Approach 2:
The patent utilizes the depth dimension of the concave groove (extending in the thickness direction) to provide adequate bonding area. By optimizing the groove depth and asymmetric planar dimensions, sufficient bonding capacity is achieved without increasing the lateral footprint of the device, thus reducing device size while maintaining mounting strength
2Volume of moving object
If the dimensions of concave grooves are reduced to decrease device size, then the product size is reduced, but the bonding area with mounting substrate becomes insufficient
Solution Approach 1:
The asymmetric configuration where the first distance exceeds the second distance allows the concave groove to maximize bonding area in the critical first direction (parallel to front surface) while minimizing dimensions in other directions. This enables sufficient bonding area to be achieved without increasing overall device volume
Solution Approach 2:
The patent compensates for reduced planar bonding area by utilizing the depth dimension of the concave groove. The groove extends in the thickness direction to provide adequate bonding surface area, allowing device size reduction in the lateral directions while maintaining sufficient total bonding area through vertical space utilization
Data Source
AI summary
A semiconductor light-emitting device includes: a substrate with a wiring formed thereon; and a semiconductor light-emitting element. The substrate has first and second main surfaces in its thickness direction, first and second side surfaces in a first direction, third and fourth side surfaces in a second direction, and a first concave groove formed between the first and the third side surfaces. The first side surface has a first edge in contact with the first concave groove, the second side surface has a second edge, and the third side surface has a third edge in contact with the first concave groove and a fourth edge. The wiring includes a first groove wiring formed in the first concave groove and a first distance between the first edge and the third edge is larger than a second distance between the second edge and the fourth edge.