Semiconductor Light Emitting Device Growth Substrate Partition Wall
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Solution Overview
Problem
Current display devices using semiconductor light emitting devices face challenges such as high fabrication costs and low yield due to the need for removing the growth substrate, which is complex and expensive, especially when applying these devices to digital signage.
Innovation Solution
A display device structure where the growth substrate is used as a partition wall, eliminating the need for substrate removal, and a fabrication method involving the growth of semiconductor light emitting devices on a substrate, followed by etching to form through holes for wavelength conversion and electrical connection to a wiring substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the growth substrate is removed using conventional methods (laser lift-off), then the semiconductor light emitting devices can be transferred to the wiring substrate, but the fabrication cost increases and yield decreases
Solution Approach 1:
The invention extracts the growth substrate removal process from the fabrication sequence by making the growth substrate itself etchable. Through holes are formed directly through the growth substrate to allow wavelength conversion material to contact the semiconductor light emitting devices, eliminating the need for expensive laser lift-off while maintaining device functionality and yield
Solution Approach 2:
The invention changes the physical-chemical parameters of the growth substrate by selecting materials (such as silicon-based substrates) that can be etched using standard semiconductor fabrication processes. This parameter change enables the substrate to be removed or penetrated through conventional etching methods rather than requiring specialized laser lift-off equipment
2Manufacturing precision
If the growth substrate is removed using laser lift-off method, then the semiconductor light emitting devices can be transferred, but the fabrication process becomes complex and expensive
Solution Approach 1:
The invention merges the substrate removal function with the wavelength conversion material delivery path by forming through holes through the growth substrate. This combines multiple functions (substrate removal, material delivery, and device connection) into a single integrated structure, simplifying the overall fabrication process while maintaining precision
Solution Approach 2:
The invention performs preliminary action by pre-forming the through holes in the growth substrate before transferring the semiconductor light emitting devices. This preliminary structuring of the substrate eliminates the need for complex post-transfer processing and simplifies the overall fabrication sequence
3Productivity
If the growth substrate is kept as a partition wall structure, then substrate removal is eliminated and yield increases, but the structure becomes more complex
Solution Approach 1:
The growth substrate serves multiple functions simultaneously: it acts as a support substrate during device growth, as a partition wall structure for organizing devices, and as a medium through which wavelength conversion material is delivered. This multi-functionality eliminates the need for separate substrate removal while maintaining structural organization
Solution Approach 2:
The wavelength conversion material is nested within the through holes of the growth substrate, which itself is nested within the overall display device structure. This nested arrangement allows the substrate to remain as a functional partition wall while providing internal pathways for optical material, avoiding the need for substrate removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces fabrication costs, increases yield, and allows for high-precision batch processing of flexible display devices without the need for expensive laser lift-off methods, enabling the production of high-resolution displays with improved reliability.
Implementation Method 1
a wavelength conversion material filled into the through holes to convert a wavelength of light emitted from corresponding semiconductor light emitting devices
Data Source
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Figure 3a~4
AI summary
A display device including a growth substrate; a plurality of semiconductor light emitting devices grown on the growth substrate and disposed on one surface of the growth substrate; a plurality of through holes passing through the growth substrate at positions overlapping with the semiconductor light emitting devices; a wavelength conversion material filled into the through holes to convert a wavelength of light emitted from corresponding semiconductor light emitting devices; and a wiring substrate electrically connected to an electrode of the semiconductor light emitting devices disposed at an opposite side of the growth substrate by interposing the semiconductor light emitting devices therebetween.