LED Headlamp Assembly with Scattering Optical Layer
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Solution Overview
Problem
Conventional LED headlamps face challenges in achieving high contrast while minimizing light loss due to the trade-off between light extraction efficiency and the use of cutoff shields, which are often necessary for regulatory compliance.
Innovation Solution
An LED assembly is designed with a substrate, LED chips, a first reflection layer on the side surfaces of the chips, an optical layer including a scattering particle like silicon dioxide, a phosphor layer for color conversion, and a second reflection layer on the optical and phosphor layers, all formed using materials like titanium dioxide or silicon dioxide, to enhance contrast and light extraction efficiency without a physical shield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a cutoff shield is used to block dispersed light from LED chips, then contrast is improved, but light extraction efficiency decreases
Solution Approach 1:
The patent extracts and removes the harmful dispersed light from LED chips using a light extraction structure with specific geometric features (grooves, holes, or textured surfaces) on the chip surface. This allows the light to be directed away from the chip edges where it would otherwise disperse and create glare, while maintaining the beneficial direct light output.
Solution Approach 2:
The patent applies different optical properties to different regions of the LED structure. The chip surface includes localized light extraction features (grooves, holes, or textured areas) that selectively manage light dispersion at specific locations, while other areas maintain standard characteristics for optimal light output. This localized modification achieves contrast improvement without globally reducing light extraction efficiency.
2Illumination intensity
If light is blocked from dispersed sides of LED chips to achieve high contrast, then contrast is improved, but overall light output decreases
Solution Approach 1:
The patent converts the harmful dispersed light at LED chip edges into a beneficial component by using light extraction structures (grooves, holes, or textured surfaces) to redirect this light in controlled directions. The light that would otherwise create glare is instead channeled to enhance the overall light output and improve contrast simultaneously.
Solution Approach 2:
The patent addresses light dispersion by introducing vertical dimensionality through three-dimensional light extraction features (grooves, holes, or textured surfaces) on the chip surface. This vertical structure manages light in the vertical dimension, preventing horizontal dispersion while maintaining overall light output through controlled light pathways.
3Illumination intensity
If a physical shield is added to block dispersed light, then contrast is improved, but device complexity increases
Solution Approach 1:
The patent merges the light extraction function with the chip structure itself by integrating light extraction features (grooves, holes, or textured surfaces) directly into the LED chip or its immediate packaging. This eliminates the need for separate physical shields or cutoff structures, as the chip structure itself performs the light management function.
Solution Approach 2:
The LED structure is designed to be self-managing for light extraction and direction control. The light extraction features (grooves, holes, or textured surfaces) are built into the chip or packaging to automatically manage light dispersion without requiring external control mechanisms or additional shield components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves light extraction efficiency and achieves high contrast by scattering and reflecting light effectively, reducing light loss and eliminating the need for a separate shield structure, thus simplifying the headlamp design.
Implementation Method 1
an optical layer formed on the at least one LED chip, a phosphor layer formed on the optical layer
Implementation Method 2
a first reflection layer formed on a side surface of the at least one LED chip, a second reflection layer formed on side surfaces of the optical layer and the phosphor layer
Implementation Method 3
a phosphor layer formed on the optical layer
Data Source
AI summary
An LED assembly according to an embodiment of the present invention may improve dark regions generated between LED chips by employing a first reflective layer between the LED chips. By employing a transparent optical layer or an optical layer including a scattering particle between an LED chip and a phosphor layer, direct contact between the LED chip and the phosphor layer may be avoided, thereby preventing a low light extraction efficiency. Further, by employing a second reflection layer on side surfaces of an to LED chip, an optical layer, and a phosphor layer, a relatively high contrast may be obtained. An LED assembly may enhance contrast through a reflective layer while increasing light extraction efficiency by including a scattering particle in a phosphor layer.