Heat-Conducting Structure for LED Thermal Management

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Solution Overview

Problem

Light-emitting devices with wavelength conversion covers experience thermal quenching and color shift due to accumulated thermal energy, degrading fluorescent conversion efficiency and causing unwanted color shifts.

Innovation Solution

A heat-conducting structure is integrated into the light-emitting device, directly contacting the wavelength converting cover to quickly dissipate heat produced by the light-emitting element, thereby reducing thermal quenching and enhancing heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a wavelength conversion cover is used to achieve different light colors, then light color variety is improved, but thermal energy accumulation occurs causing thermal quenching and color shift

Engineering Contradiction:
Improvelight color varietyVSAvoidwavelength conversion cover temperature
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent introduces a heat-conducting structure as an intermediary component between the LED light source module and the wavelength conversion cover. This heat-conducting structure serves as a thermal mediator that transfers heat away from the wavelength conversion cover, allowing the cover to maintain its wavelength conversion function without excessive temperature rise, thus resolving the contradiction between achieving different light colors and preventing thermal quenching

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent extracts the heat management function from the wavelength conversion cover itself by introducing a separate heat-conducting structure. This separates the wavelength conversion function from the heat dissipation function, allowing the wavelength conversion cover to focus on its primary function while the heat-conducting structure handles thermal management, thereby preventing thermal quenching while maintaining color variety

Inventive Principle:
Principle #2Taking out (Extraction)

2Device complexity

If heat is allowed to accumulate on wavelength conversion cover, then simple structure is maintained, but fluorescent conversion effect degrades and color shift occurs

Engineering Contradiction:
Improvestructure simplicityVSAvoidfluorescent conversion effect
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The heat-conducting structure serves as a thermal intermediary that can be integrated into the existing device architecture with minimal structural modification. This intermediary component enables effective heat management and prevents fluorescent conversion degradation without significantly increasing device complexity, as it can be implemented as a substrate or heat sink integrated with the LED module

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces thermal quenching and maintains luminescent efficiency by efficiently dissipating heat away from the wavelength conversion cover, improving the overall heat-dissipating effect and preventing color shifts in light-emitting devices.

Implementation Method 1

a heat-conducting structure comprising a plurality of accommodating spaces... the heat-conducting structure can quickly expel the heat produced by a light-emitting element via the base

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9184360B2Light-emitting device
Publication Date: 2015.11.10 NICHIA CORP
  • US9184360B2 patent drawing
  • US9184360B2 patent drawing
  • US9184360B2 patent drawing

AI summary

A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.