LED Package Heat Dissipating Slugs for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light emitting diode (LED) packages with separate heat sinks are complex and costly to manufacture, leading to inefficient heat dissipation and reduced photometric efficiency due to increased junction temperature from higher input currents.
Innovation Solution
A light emitting diode package with first and second heat dissipating slugs made of conductive materials, exposed through the package main body for improved heat dissipation, potentially featuring fins and a metal reflector for enhanced cooling and optical efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate heat sink is coupled to the lead frame, then heat dissipation is achieved, but the package structure becomes complicated and manufacturing cost increases
Solution Approach 1:
The patent combines the heat sink function with the lead frame structure by forming heat dissipating slugs directly on the lead frame. The lead frame serves dual purposes: electrical connection and heat dissipation. This merging eliminates the need for a separate heat sink component, simplifying the package structure while maintaining effective heat dissipation capability.
Solution Approach 2:
The lead frame is designed to perform multiple functions simultaneously: providing electrical connections for the LED die and serving as a heat dissipation structure through the integrated heat dissipating slugs. This multi-functionality reduces the number of components needed and simplifies the overall package design.
2Power
If the magnitude of input current is increased, then high optical power is obtained, but junction temperature increases and photometric efficiency is reduced
Solution Approach 1:
The patent extracts heat away from the LED die junction by providing dedicated heat dissipating slugs that are in direct thermal contact with the die. These slugs conduct heat away from the junction region efficiently, allowing high input currents to be used for high optical power output without excessive junction temperature buildup that would reduce photometric efficiency.
3Temperature
If a separate heat sink is used, then heat dissipation is improved, but manufacturing process becomes complicated
Solution Approach 1:
The heat dissipation structure is merged into the lead frame itself through the heat dissipating slugs, which are formed as integral parts of the lead frame structure. This eliminates the need for separate assembly steps to attach a heat sink, simplifying the manufacturing process while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a simple, cost-effective structure for efficient heat dissipation, maintaining photometric efficiency by using heat dissipating slugs as external leads and increasing surface area for cooling, while preventing package deterioration from emitted light.
Implementation Method 1
first and second heat dissipating slugs spaced apart from each other. The first and second heat dissipating slugs are formed of a conductive material... since heat can be dissipated through the first and second heat dissipating slugs
Implementation Method 2
portions of the first and second heat dissipating slugs which are exposed through the side surfaces of the package main body may include a plurality of fins. The fins cause the surface area of the first and second heat dissipating slugs to be increased, so that the heat dissipation performance can be improved
Implementation Method 3
The fins cause the surface area of the first and second heat dissipating slugs to be increased, so that the heat dissipation performance can be improved
Data Source
AI summary
A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.