LED Heat-Dissipating Substrate with Segmented Blocks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional circuit boards have limited heat-dissipating capabilities and high costs due to small heat-dissipating areas and poor heat resistance, failing to meet increasing thermal demands.
Innovation Solution
A heat-dissipating substrate with a panel shape, comprising a first and second heat-dissipating block, a heat-dissipating plate, and lateral insulating members, providing improved thermal and electrical conductivity by isolating these components and forming a larger heat-dissipating area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum nitride substrate is used for circuit board, then heat dissipation performance is improved, but manufacturing cost increases significantly
Solution Approach 1:
The substrate is divided into multiple heat-dissipating blocks (first heat-dissipating block, second heat-dissipating block, third heat-dissipating block) that are spatially separated and electrically isolated. This segmentation allows the use of cost-effective materials for each block while collectively achieving superior heat dissipation performance, avoiding the need for expensive aluminum nitride substrate across the entire board.
Solution Approach 2:
Different regions of the substrate are assigned different functions: heat-dissipating blocks provide thermal management, insulating blocks provide electrical isolation, and conductive blocks provide electrical connectivity. This local differentiation optimizes performance in each region while controlling overall manufacturing cost by using appropriate materials only where needed.
2Area of stationary object
If conventional circuit board structure is used, then manufacturing simplicity is maintained, but heat dissipation area is insufficient
Solution Approach 1:
The substrate is divided into multiple heat-dissipating blocks (first heat-dissipating block, second heat-dissipating block, third heat-dissipating block) that are spatially separated and electrically isolated. This segmentation allows the use of cost-effective materials for each block while collectively achieving superior heat dissipation performance, avoiding the need for expensive aluminum nitride substrate across the entire board.
Solution Approach 2:
Different regions of the substrate are assigned different functions: heat-dissipating blocks provide thermal management, insulating blocks provide electrical isolation, and conductive blocks provide electrical connectivity. This local differentiation optimizes performance in each region while controlling overall manufacturing cost by using appropriate materials only where needed.
3Reliability
If conductive pillar is added to through hole, then electrical conductivity is provided, but heat dissipation capability remains poor
Solution Approach 1:
The substrate is divided into multiple heat-dissipating blocks (first heat-dissipating block, second heat-dissipating block, third heat-dissipating block) that are spatially separated and electrically isolated. This segmentation allows the use of cost-effective materials for each block while collectively achieving superior heat dissipation performance, avoiding the need for expensive aluminum nitride substrate across the entire board.
Solution Approach 2:
Different regions of the substrate are assigned different functions: heat-dissipating blocks provide thermal management, insulating blocks provide electrical isolation, and conductive blocks provide electrical connectivity. This local differentiation optimizes performance in each region while controlling overall manufacturing cost by using appropriate materials only where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate achieves a 70% reduction in heat resistance compared to aluminum nitride substrates and a 90% reduction compared to FR4 boards, while lowering costs by 95%, effectively addressing the limitations of conventional circuit boards.
Implementation Method 1
a lateral insulating member connected to thereof so as to electrically isolate the first heat-dissipating block, the second heat-dissipating block, and the heat-dissipating plate from each other
Implementation Method 2
The first heat-dissipating block, the second heat-dissipating block and the heat-dissipating plate each has two protrusions respectively formed on two opposite surfaces thereof... occupy a greater portion of the heat-dissipating substrate, so that the heat-dissipating substrate can be formed with a better thermally conductive property
Data Source
AI summary
The present disclosure discloses a light emitting diode (LED) package structure, a heat-dissipating substrate, a method for manufacturing an LED package structure, and a method for manufacturing a heat-dissipating substrate. The method for manufacturing the heat-dissipating substrate includes: providing a metal plate having a top surface and a bottom surface; implementing an etching process on the metal plate so as to form a first heat-dissipating block, a second heat-dissipating block, and a heat-dissipating plate spaced apart from each other; and filling an insulating material between the heat-dissipating plate and the first heat-dissipating block and between the heat-dissipating plate and the second heat-dissipating block so as to electrically isolate the heat-dissipating plate, the first heat-dissipating block, and the second heat-dissipating block from each other.